Low temperature operation of undoped body triple-gate FinFETs from an analog perspective
N/D
Tipo de produção
Artigo de evento
Data de publicação
2007-09-06
Texto completo (DOI)
Periódico
ECS Transactions
Editor
Texto completo na Scopus
Citações na Scopus
1
Autores
Marcelo Antonio Pavanello
MARTINO, J. A.
SIMOEN, E.
ROOYACKERS R.
COLLAERT, N.
CLAEYS, C
Orientadores
Resumo
This paper studies the temperature reduction influence on some analog figures of merit of n-type triple-gate FinFETs with undoped body, using DC measurements. It is demonstrated that the temperature reduction improves the transconductance over drain current ratio in any operational region. On the other hand, the output conductance is degraded when the temperature is reduced. The combination of these effects shows that the intrinsic gain of a L=90 nm FinFET is degraded by 3 dB when the temperature reduces from 300 K down to 100 K. A comparison with planar single gate fully depleted SOI reveals that the temperature degradation of the output conductance in FinFETs is less temperature-dependent. © The Electrochemical Society.
Citação
PAVANELLO, M. A.; MARTINO, J. A.; SIMOEN, E.; ROOYACKERS R.; COLLAERT, N.; CLAEYS, C. Low temperature operation of undoped body triple-gate FinFETs from an analog perspective. ECS Transactions, v. 9, n. 1, p. 19-27, 2007.
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Keywords
Assuntos Scopus
Current ratios; DC measurements; Electrochemical Society (ECS); Figures of Merit (FOM); FinFETs; Fully depleted SOI (FD SOI); Low temperature (LTR); Microelectronics technology; Output conductance; Single gate (SG); temperature degradation; temperature dependent; Temperature reduction; Triple Gate; Undoped body