Temperature influences on FinFETs with undoped body
N/D
Tipo de produção
Artigo de evento
Data de publicação
2007-05-11
Texto completo (DOI)
Periódico
ECS Transactions
Editor
Texto completo na Scopus
Citações na Scopus
4
Autores
Marcelo Antonio Pavanello
MARTINO J. A.
SIMOEN, E.
ROOYACKERS, R.
COLLAERT, N.
CLAEYS, C.
Orientadores
Resumo
This work presents a study, based on DC measurements, of the temperature influence on the performance of nMOS triple-gate FinFETs with high-κdielectrics, TiN gate material and an undoped body. FinFETs show smaller threshold voltage variations with temperature than planar fully-depleted SOI MOSFETs. The subthreshold slope reduced with the temperature and approached the ideal value at lower temperatures In the temperature range under study the mobility increases linearly as the temperature is reduced and the dominating mobility degradation factor is phonon scattering. The DIBL has been evaluated and no temperature dependence has been found. Finally, the series resistance has been also extracted and demonstrates a reduction as the temperature is reduced due to the mobility improvement. © The Electrochemical Society.
Citação
PAVANELO, M. A.; MARTINO J. A.; SIMOEN, E.; ROOYACKERS, R.; COLLAERT, N.; CLAEYS, C. Temperature influences on FinFETs with undoped body. ECS Transactions, v. 6, n. 4, p. 211-216, May, 2007.
Palavras-chave
Keywords
Assuntos Scopus
DC measurements; Electrochemical Society (ECS); FinFETs; Fully-depleted (FD); Gate materials; International symposium; mobility degradation; Series resistance (ESR); Silicon on insulator (SOI) technology; SOI-MOSFETs; subthreshold slopes; Temperature dependences; Temperature influence; temperature ranges; Threshold voltage variations; Triple Gate; Undoped body