Repositório do Conhecimento Institucional do Centro Universitário FEI
 

Temperature influences on FinFETs with undoped body

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Tipo de produção

Artigo de evento

Data de publicação

2007-05-11

Texto completo (DOI)

Periódico

ECS Transactions

Editor

Citações na Scopus

4

Autores

Marcelo Antonio Pavanello
MARTINO J. A.
SIMOEN, E.
ROOYACKERS, R.
COLLAERT, N.
CLAEYS, C.

Orientadores

Resumo

This work presents a study, based on DC measurements, of the temperature influence on the performance of nMOS triple-gate FinFETs with high-κdielectrics, TiN gate material and an undoped body. FinFETs show smaller threshold voltage variations with temperature than planar fully-depleted SOI MOSFETs. The subthreshold slope reduced with the temperature and approached the ideal value at lower temperatures In the temperature range under study the mobility increases linearly as the temperature is reduced and the dominating mobility degradation factor is phonon scattering. The DIBL has been evaluated and no temperature dependence has been found. Finally, the series resistance has been also extracted and demonstrates a reduction as the temperature is reduced due to the mobility improvement. © The Electrochemical Society.

Citação

PAVANELO, M. A.; MARTINO J. A.; SIMOEN, E.; ROOYACKERS, R.; COLLAERT, N.; CLAEYS, C. Temperature influences on FinFETs with undoped body. ECS Transactions, v. 6, n. 4, p. 211-216, May, 2007.

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Keywords

Assuntos Scopus

DC measurements; Electrochemical Society (ECS); FinFETs; Fully-depleted (FD); Gate materials; International symposium; mobility degradation; Series resistance (ESR); Silicon on insulator (SOI) technology; SOI-MOSFETs; subthreshold slopes; Temperature dependences; Temperature influence; temperature ranges; Threshold voltage variations; Triple Gate; Undoped body

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