Semiconductor bending setup for electrical characterization of mechanical stress
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2017-09-01
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BÜHLER, Rudolf Theoderich
PERIN, A. L.
Renato Giacomini
PERIN, A. L.
Renato Giacomini
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INSCIT 2017 - 2nd International Symposium on Instrumentation Systems, Circuits and Transducers: Chip on the Sands, Proceedings
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BÜHLER, R. T.; PERIN, A. L.; GIACOMINI, R. Semiconductor bending setup for electrical characterization of mechanical stress. INSCIT 2017 - 2nd International Symposium on Instrumentation Systems, Circuits and Transducers: Chip on the Sands, Proceedings, Sept. 2017.
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© 2017 IEEE.This work proposes and describes in details a complete setup solution for testing of non-encapsulated electronic devices under mechanical stress. The equipment was implemented and calibrated to later use in electrical characterization of devices, such as MOSFETs and diodes under controlled mechanical stress. The semiconductor bending equipment allows the electrical characterization of devices using already existent probe stations in laboratories without additional modifications, as presented here.