Analysis of FPGA SEU sensitivity to combined effects of conducted EMI and TID

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6
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2016-05-17
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BENFICA, J.
GREEN, B.
PORCHER, B. C.
POEHLS, L. B.
VARGAS, F.
MEDINA, N. H.
ADDED, N.
AGUIAR, V. A. P. DE
MACCHIONE, E. L. A.
AGUIRRE, F.
Marcilei Aparecida Guazzelli
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2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
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BENFICA, J.; GREEN, B.; PORCHER, B. C.; POEHLS, L. B.; VARGAS, F.; MEDINA, N. H.; ADDED, N.;AGUIAR, V. A. P. DE; MACCHIONE, E. L. A.; AGUIRRE, F.; GUAZZELLI, M. A. Analysis of FPGA SEU sensitivity to combined effects of conducted EMI and TID. 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, p. 887-889, mayo, 2016.
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© 2016 IEEE.This work proposes a novel methodology to evaluate SRAM-Based FPGA SEU susceptibility to noise on VDD power pins and total-ionizing dose (TID). The procedure was demonstrated for SEU measurements on a Xilinx Spartan 3E FPGA operating in an 8MV Pelletron accelerator, whereas TID was deposited by means of a Shimadzu XRD-7000 X-ray diffractometer. The injected noise on power supply bus comprised of voltage dips of 16.67% and 25% of VDD at two different frequencies 10Hz and 5kHz, and was performed according to the IEC 61.000-4-29 international standard.

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