Open model for external mechanical stress of semiconductors and MEMS

BÜHLER, Rudolf TheoderichRenato Giacomini2022-01-122022-01-122018-03-22BÜHLER, R. T.; GIACOMINI, R. Open model for external mechanical stress of semiconductors and MEMS.IEEE International Conference on Microelectronic Test Structures, p. 189-193, March, 2018.https://repositorio.fei.edu.br/handle/FEI/3787© 2018 IEEE.This paper defines the details of the bending equipment solution and the calibration required for characterization of external mechanical stress in semiconductors and MEMS. The equipment is suited for use in probe station for electrical characterization of devices under controlled external mechanical stress.Acesso RestritoOpen model for external mechanical stress of semiconductors and MEMSArtigo de evento10.1109/ICMTS.2018.8383795external mechanical stressMEMSsemiconductor