Foreword Special Issue on Compact Modeling of Semiconductor Devices

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dc.contributor.authorINIGUEZ, B.
dc.contributor.authorCHAUHAN, Y. S.
dc.contributor.authorMIJALKOCIC, S.
dc.contributor.authorXIA, K.
dc.contributor.authorGOO, J. S.
dc.contributor.authorMarcelo Antonio Pavanello
dc.contributor.authorMIERZWINSKI, M.
dc.contributor.authorGRABINSKI, W.
dc.contributor.authorOrcidhttps://orcid.org/0000-0003-1361-3650
dc.date.accessioned2022-01-12T21:55:28Z
dc.date.available2022-01-12T21:55:28Z
dc.date.issued2020-05-05
dc.description.firstpage1350
dc.description.lastpage1353
dc.description.volume8
dc.identifier.citationINIGUEZ, B.; CHAUHAN, Y. S.; MIJALKOCIC, S.; XIA, K.; GOO, J. S.; PAVANELLO, M. A. Foreword Special Issue on Compact Modeling of Semiconductor Devices. IEEE Journal of the Electron Devices Society, v. 8, n. 1, p. 1350-1353, Jan. 2020.
dc.identifier.doi10.1109/JEDS.2020.3039023
dc.identifier.issn2168-6734
dc.identifier.urihttps://repositorio.fei.edu.br/handle/FEI/3660
dc.relation.ispartofIEEE Journal of the Electron Devices Society
dc.rightsAcesso Aberto
dc.titleForeword Special Issue on Compact Modeling of Semiconductor Devices
dc.typeEditorial
fei.scopus.citations0
fei.scopus.eid2-s2.0-85097906204
fei.scopus.updated2024-07-01
fei.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85097906204&origin=inward
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