Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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5 resultados
Resultados da Pesquisa
- Analog parameters of strained non-rectangular triple gate FinFETs(2010-01-05) BÜHLER, Rudolf Theoderich; Renato Giacomini; MARTINO, J. A.The strained silicon technology together to the reduction of the temperature is studied in this paper on trapezoidal triple gate FinFETs, through three-dimensional numerical simulation, with particular focus on analog parameters. The comparison of the intrinsic voltage gain between the different trapezoidal fin shapes demonstrated that, although the strained silicon technology provided higher intrinsic voltage gain, the fin shape can have a major role in analog parameters, helping to improve those parameters under certain circumstances. Higher intrinsic voltage gains were obtained for strained devices with top fin width larger than bottom. ©The Electrochemical Society.
- Sidewall angle influence on the FinFET analog parameters(2007-09-06) Renato Giacomini; MARTINO, J. A.; Marcelo Antonio PavanelloThe width variations along the vertical direction, due to process limitations, that appear in some fabricated FinFETs lead to non-rectangular cross-sectional shapes. One of the most frequent shapes is the trapezoidal (inclined sidewalls). These geometry variations may cause some changes in the device electrical characteristics. This work analyses the influence of the sidewall inclination angle on analog parameters, such as voltage gain, transconductance, output conductance, threshold voltage and also on the corner effects, through 3-D numeric simulation. © The Electrochemical Society.
- Non-vertical sidewall angle influence on triple-gate FinFETs corner effects(2007-05-11) Renato Giacomini; MARTINO J. A.Some fabricated FinFET devices present width variations along the vertical direction due to fabrication process limitations. These variations lead to non-rectangular cross-section shapes. One of the most frequent shapes is the trapezoidal (plane and inclined sidewalls). Another identified phenomenon in multiple-gate devices such as FinFETs is the corner effect, which occurs due to the overlapping of the influences of two gate planes near the device corners. This paper addresses the variation of the corner effect as a function of the sidewall inclination angle, through 3-D numeric simulation. A set of devices of several inclination angles and body doping levels were simulated. The corner effect depends on the inclination angle, specially for higher doping levels. © The Electrochemical Society.
- An analytical estimation model for the spreading resistance of Double-Gate FinFETs(2012-03-17) MALHEIRO, C. T.; PEREIRA, A. S. N.; Renato GiacominiThe FinFET spreading resistance is the component of the parasitic resistance of FinFETs caused by the curved shape of the current lines in drain and source regions, close to the junctions. This work proposes a very simple analytical model for the spreading resistance of Double-Gate FinFETs that is valid for any fin width from 16nm, without fitting parameters. The model output was compared to data extracted from numeric simulation and it showed accuracy better than 8% for the considered range of devices with three different doping concentrations. © 2012 IEEE.
- Sensing magnetic fields in any direction using FinFETs and L-gate FinFETs(2012-10-04) PERIN, A. L.; Renato GiacominiThe best-explored integrated magnetic field sensors are built with planar IC technologies, which do not allow 3D sensing in standard fabrication processes due to their bi-dimensional nature. Unlike planar devices, FinFETs can be used to sense magnetic fields in any direction. This work proposes and evaluates the use of FinFETs as magnetic sensors. The sensibility of FinFET differential arrays to lateral and vertical magnetic fields is quantified. This work also proposes the L-shaped gate, to improve the sensor performance. © 2012 IEEE.