Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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3 resultados
Resultados da Pesquisa
- Low-frequency noise of n-type triple gate FinFETs fabricated on standard and 45 rotated substrates(2013) Doria R.T.; Martino J.A.; Simoen E.; Claeys C.; Pavanello M.A.This paper studies the impact of the 45 substrate rotation on the low-frequency noise (LFN) of triple gate nFinFETs. The overall LFN has been extracted for both standard and 45 substrate rotated devices of several fin widths at different drain and gate voltage biases focusing on their operation in saturation regime. A general view of the mechanisms which govern the low-frequency noise in MOS devices is provided and a brief discussion on the physical origins of the LFN in the evaluated devices is carried out. It has been noted that the LFN in non-rotated (0 rotated) and 45 rotated devices operating in the linear regime shows 1/f behavior independent on the gate bias, whereas in the saturation regime both 1/f and Lorentzian (1/f2) noises are observed. The former one prevails at lower frequencies and the 1/f2 noise at higher ones. In this case, the corner frequency shows an exponential dependence on the gate bias. © 2013 Elsevier Ltd. All rights reserved.
- Harmonic distortion of 2-MOS structures for MOSFET-C filters implemented with n-type unstrained and strained FINFETS(2011) Doria R.T.; Simoen E.; Claeys C.; Martino J.A.; Pavanello M.A.This work investigates the harmonic distortion (HD) in 2-MOS balanced structures composed of triple gate FinFETs. HD has been evaluated through the determination of the third-order harmonic distortion (HD3), since this represents the major non-linearity source in balanced structures. The 2-MOS structures with devices of different channel lengths (L) and fin widths (W fin) have been studied operating in the linear region as tunable resistors. The analysis was performed as a function of the gate voltage, aiming to verify the correlation between operation bias and HD3. The physical origins of the non-linearities have been investigated and are pointed out. Being a resistive circuit, the 2-MOS structure is generally projected for a targeted on-resistance, which has also been evaluated in terms of HD3. The impact of the application of biaxial strain has been studied for FinFETs of different dimensions. It has been noted that HD3 reduces with the increase of the gate bias for all the devices and this reduction is more pronounced both in narrower and in longer devices. Also, the presence of strain slightly diminishes the non-linearity at a similar bias. However, a drawback associated with the use of strain engineering consists in a significant reduction of the on-resistance with respect to unstrained devices. © 2011 Elsevier Ltd. All rights reserved.
- Impact of halo implantation on 0.13 μm floating body partially depleted SOI n-MOSFETs in low temperature operation(2005) Pavanello M.A.; Martino J.A.; Simoen E.; Claeys C.This work studies the effect of halo implantation on the electrical characteristics of deep-submicrometer partially depleted SOI nMOSFETs during low temperature and floating body operation. Parameters such as the drain induced barrier lowering (DIBL) and the device thermal resistance have been investigated. It is shown that the combination of floating body operation with halo implantation degrades the DIBL in the temperature range studied (90 K-300 K) in comparison to devices that did not received this implantation. The halo region causes a more pronounced negative output conductance than for the transistors without a halo implantation. An estimation of the temperature rise for a given dissipated power in both types of devices is made, based on the thermal resistance, which is derived from the output characteristics in function of the temperature. © 2005 Elsevier Ltd. All rights reserved.