UTBB MOSFETs Thermal Coupling Analysis in Technological Node Level

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dc.contributor.authorCOSTA, F. J.
dc.contributor.authorDORIA, R. T.
dc.contributor.authorRodrigo Trevisoli Doria
dc.date.accessioned2021-11-25T22:33:31Z
dc.date.available2021-11-25T22:33:31Z
dc.date.issued2020-07-31
dc.description.abstractThe main goal of this work is to perform a first-time analysis of the thermal cross-coupling in a system composed by some devices in an integration node degree composed by advanced UTBB SOI MOSFETs through numerical simulations, validated with experimental data from the literature. In this analysis, it could be observed that devices located on the channel length direction provoke a reduced thermal coupling and devices with their drain region next to each other suffer of an increased thermal coupling due to the lumped thermal energy. It also could be observed a degradation in some electrical parameters and in the thermal properties of a device under the influence of surrounded devices biased.
dc.description.firstpage1
dc.description.issuenumber2
dc.description.lastpage5
dc.description.volume15
dc.identifier.citationCOSTA, F. J.; TREVISOLI, R.; DORIA, R. T.. UTBB MOSFETs Thermal Coupling Analysis in Technological Node Level. JICS. JOURNAL OF INTEGRATED CIRCUITS AND SYSTEMS (ED. PORTUGUÊS), v. 15, n. 2, p. 1-5, 2020.
dc.identifier.doi10.29292/jics.v15i2.194
dc.identifier.issn1807-1953
dc.identifier.urihttps://repositorio.fei.edu.br/handle/FEI/3479
dc.relation.ispartofJICS. JOURNAL OF INTEGRATED CIRCUITS AND SYSTEMS (ED. PORTUGUÊS)
dc.rightsAcesso Aberto
dc.rights.licenseOpen Journal Systems "Este é um artigo publicado em acesso aberto sob uma licença de código aberto (GPL v2). Fonte: https://jics.org.br/ojs/index.php/JICS/article/view/194. Acesso em 25 nov. 2021.
dc.subjectSOI
dc.subjectUTBB
dc.subjectSelf-Heating
dc.subjectThermal Resistance
dc.subjectThermal-Coupling
dc.titleUTBB MOSFETs Thermal Coupling Analysis in Technological Node Levelpt_BR
dc.typeArtigopt_BR
fei.scopus.citations5
fei.scopus.eid2-s2.0-85089852047
fei.scopus.updated2024-03-04
fei.source.urlhttps://jics.org.br/ojs/index.php/JICS/article/view/194
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