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Drain leakage current in Δ-channel SOI nMOSFET operating at high temperatures

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Tipo de produção

Artigo de evento

Data de publicação

2012

Texto completo (DOI)

Periódico

ECS Transactions

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Citações na Scopus

0

Autores

CORREIA, M. M.
BELLODI, M.

Orientadores

Resumo

This paper presents the electric behavior of Δ-channel SOI nMOSFET transistors (triangular channel), as a function of the channel geometric dimensions, such as the channel length (L) and the internal angle (θ) of the triangular structure, in the drain leakage current (IDleak) behavior, for these devices operating from room temperature up to 300°C. Through three-dimensional numeric simulations it was observed that I Dleak is composed mainly by electrons, in all analyzed devices operating at high temperatures. Besides that, as L reduces, it was noticed that IDleak increases. However, for smaller angles θ, results smaller IDleak values, when the transistors are operating at same bias and temperature conditions. ©The Electrochemical Society.

Citação

CORREIA, M. M.; BELLODI, M. Drain leakage current in Δ-channel SOI nMOSFET operating at high temperatures. ECS Transactions, v. 45, n. 7, p. 209-220, May. 2012.

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Keywords

Assuntos Scopus

Drain leakage current; Electric behavior; Geometric dimensions; nMOSFET transistors; Numeric simulation; Temperature conditions; Triangular channel; Triangular structures

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