An improved model for the triangular SOI misalignment test structure

Abstract

The triangular misalignment test structure is an arrangement of MOS transistors to calculate the poly and source/drain diffusion misalignment as a function of drain current differences. Although these structures have non-rectangular shapes, which may be detrimental for the design, the advantage of measuring currents instead of voltage differences make them very useful. This work presents a new analytic misalignment error model for thin-film, fully depleted SOI technology, using non rectangular devices. Three-dimensional numerical simulation is used as a reference for models comparison and verification. These simulation results show that the proposed analytical model presents an improved performance compared to those available in the literature.