Analysis of the Thermal Properties of Self-Cascode Structures Composed by UTBB Transistors

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dc.contributor.authorCOSTA, F. J.
dc.contributor.authorTREVISOLI, R.
dc.contributor.authorMichelly De Souza
dc.contributor.authorRodrigo Doria
dc.contributor.authorOrcidhttps://orcid.org/0000-0001-6472-4807
dc.contributor.authorOrcidhttps://orcid.org/0000-0003-4448-4337
dc.date.accessioned2022-01-12T21:55:25Z
dc.date.available2022-01-12T21:55:25Z
dc.date.issued2020
dc.description.abstract© 2020 IEEE.The focus of this work is to perform an analysis of the thermal properties of the Self-Cascode (SC) structure composed by advanced UTBB SOI MOSFETs under a selected set of back gate biases, through 2D numerical simulations. In this work, it could be observed that the SC structure presents a 50 % lower thermal resistance in comparison with a single device with similar channel length. The application of a back gate bias of 2 V to the drain-sided device or -2 V to the source-sided devices of the SC has shown a decrease of 10-16 % in the thermal resistance.
dc.identifier.citationCOSTA, F. J.; TREVISOLI, R.; DE SOUZA, M.; DORIA, R. Analysis of the Thermal Properties of Self-Cascode Structures Composed by UTBB Transistors. LAEDC 2020 - Latin American Electron Devices Conference, 2020.
dc.identifier.doi10.1109/LAEDC49063.2020.9073154
dc.identifier.urihttps://repositorio.fei.edu.br/handle/FEI/3657
dc.relation.ispartofLAEDC 2020 - Latin American Electron Devices Conference
dc.rightsAcesso Restrito
dc.subject.otherlanguageSelf-Cascode
dc.subject.otherlanguageSelf-Heating
dc.subject.otherlanguageThermal Resistance
dc.subject.otherlanguageUTBB
dc.titleAnalysis of the Thermal Properties of Self-Cascode Structures Composed by UTBB Transistors
dc.typeArtigo de evento
fei.scopus.citations0
fei.scopus.eid2-s2.0-85084967502
fei.scopus.subject2-D numerical simulation
fei.scopus.subjectBack-gate bias
fei.scopus.subjectChannel length
fei.scopus.subjectSC structures
fei.scopus.subjectSelf-cascode
fei.scopus.subjectSOI-MOSFETs
fei.scopus.updated2024-07-01
fei.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85084967502&origin=inward
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