SOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes

dc.contributor.authorCOSTA, F. J.
dc.contributor.authorTREVISOLI, R.
dc.contributor.authorRodrigo Doria
dc.contributor.authorOrcidhttps://orcid.org/0000-0003-4448-4337
dc.date.accessioned2022-08-01T06:02:54Z
dc.date.available2022-08-01T06:02:54Z
dc.date.issued2022-03-01
dc.description.abstract© 2022 IEEE.The main objective of this work is to carry out an analysis of the effects of cross-coupling in a system composed of SOI UTBB MOSFETs in ultimate integration nodes through numerical simulations, validated with experimental data from literature. In this analysis, it could be observed that two devices located on the channel length direction provoke a reduced cross-coupling on each other. For devices located at distances below 50 nm, a capacitive parasitic coupling between the devices can be observed along with the thermal coupling effect.
dc.identifier.citationCOSTA, F. J.; TREVISOLI, R.; DORIA, R. SOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes. 2022 IEEE 13th Latin American Symposium on Circuits and Systems, LASCAS 2022, March, 2022.
dc.identifier.doi10.1109/LASCAS53948.2022.9789068
dc.identifier.urihttps://repositorio.fei.edu.br/handle/FEI/4545
dc.relation.ispartof2022 IEEE 13th Latin American Symposium on Circuits and Systems, LASCAS 2022
dc.rightsAcesso Restrito
dc.subject.otherlanguageCapacitances
dc.subject.otherlanguageCross-Coupling
dc.subject.otherlanguageElectrostatic-Coupling
dc.subject.otherlanguageSOI
dc.subject.otherlanguageThermal-Coupling
dc.subject.otherlanguageUTBB
dc.titleSOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes
dc.typeArtigo de evento
fei.scopus.citations1
fei.scopus.eid2-s2.0-85129322823
fei.scopus.subjectCapacitive cross-coupling
fei.scopus.subjectCapacitive parasitics
fei.scopus.subjectChannel length
fei.scopus.subjectCoupling effect
fei.scopus.subjectCross-couplings
fei.scopus.subjectElectrostatic coupling
fei.scopus.subjectMOSFETs
fei.scopus.subjectSOI
fei.scopus.subjectThermal coupling
fei.scopus.subjectUTBB
fei.scopus.updated2024-05-01
fei.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85129322823&origin=inward
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