Thermal cross-coupling effects in side-by-side UTBB-FDSOI transistors
| dc.contributor.author | COSTA, F. J. | |
| dc.contributor.author | TREVISOLI, R. | |
| dc.contributor.author | Rodrigo Doria | |
| dc.contributor.authorOrcid | https://orcid.org/0000-0003-4448-4337 | |
| dc.date.accessioned | 2022-01-12T21:53:31Z | |
| dc.date.available | 2022-01-12T21:53:31Z | |
| dc.date.issued | 2021-11-05 | |
| dc.description.abstract | © 2021 Elsevier LtdThe focus of this work is to perform a first-time analysis of the thermal cross-coupling of a device on a neighbor one in advanced UTBB transistors through 3D numerical simulations, validated with experimental data from the literature. In this work, it could be observed that the temperature rise due to a self-heated device can affect the performance of a neighbor one according to the distance between them and to the bias conditions. By varying the distance of the devices from 1 µm to 50 nm, it is shown an influence of the temperature rise due to a self-heated device in threshold voltage, subthreshold swing and in the maximum transconductance as well an increase in the thermal resistance of a neighbor device. | |
| dc.description.volume | 185 | |
| dc.identifier.citation | COSTA, F. J.; TREVISOLI, R.; DORIA, R. Thermal cross-coupling effects in side-by-side UTBB-FDSOI transistors.Solid-State Electronics, v. 185, 2021. | |
| dc.identifier.doi | 10.1016/j.sse.2021.108073 | |
| dc.identifier.issn | 0038-1101 | |
| dc.identifier.uri | https://repositorio.fei.edu.br/handle/FEI/3547 | |
| dc.relation.ispartof | Solid-State Electronics | |
| dc.rights | Acesso Restrito | |
| dc.subject.otherlanguage | Self-heating | |
| dc.subject.otherlanguage | SOI | |
| dc.subject.otherlanguage | Thermal resistance | |
| dc.subject.otherlanguage | Thermal-coupling | |
| dc.subject.otherlanguage | UTBB | |
| dc.title | Thermal cross-coupling effects in side-by-side UTBB-FDSOI transistors | |
| dc.type | Artigo | |
| fei.scopus.citations | 6 | |
| fei.scopus.eid | 2-s2.0-85111540104 | |
| fei.scopus.subject | 3-D numerical simulation | |
| fei.scopus.subject | Bias conditions | |
| fei.scopus.subject | Cross-couplings | |
| fei.scopus.subject | Maximum transconductance | |
| fei.scopus.subject | Side by sides | |
| fei.scopus.subject | Subthreshold swing | |
| fei.scopus.subject | Temperature rise | |
| fei.scopus.subject | Time analysis | |
| fei.scopus.updated | 2024-07-01 | |
| fei.scopus.url | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85111540104&origin=inward |