Comparative study of self-heating effects influence on triple-gate FinFETs fabricated on bulk, SOI and modified substrates
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Tipo de produção
Artigo de evento
Data de publicação
2013-09-02
Texto completo (DOI)
Periódico
Chip in Curitiba 2013 - SBMicro 2013: 28th Symposium on Microelectronics Technology and Devices
Editor
Texto completo na Scopus
Citações na Scopus
2
Autores
D'ANGELO, R.
AGOPIAN, P. G. D.
Orientadores
Resumo
This work presents a comparative study of the self-heating effects (SHE) influence on FinFET performance for four different substrates: Bulk, SOI, SDSOI and MSDSOI. The analysis was based on tridimensional numerical simulations and focuses mainly on the analog parameters. Although SOI FinFET devices usually present better performance than the others, when the self-heating was taking into consideration, they showed a degradation of the drain current (I DS) level resulting in a negative slope of IDS and consequently a negative output conductance precluding the intrinsic voltage gain analysis. It is demonstrated that, MSDSOI structure is the most optimized structure for analog applications varying the access window dimension depending on the gate and drain bias. © 2013 IEEE.
Citação
D'ANGELO, R.; AGOPIAN, P. G. D. Comparative study of self-heating effects influence on triple-gate FinFETs fabricated on bulk, SOI and modified substrates. Chip in Curitiba 2013 - SBMicro 2013: 28th Symposium on Microelectronics Technology and Devices, Sept. 2013.
Palavras-chave
Keywords
FinFETs; Modified SOI structures; Multiple Gate Devices; Self-heating Effect; SOI Technology
Assuntos Scopus
FinFETs; Multiple gates; Self-heating effect; SOI structure; SOI technology