Open model for external mechanical stress of semiconductors and MEMS

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Data
2018-03-22
Autores
BÜHLER, Rudolf Theoderich
Renato Giacomini
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Periódico
IEEE International Conference on Microelectronic Test Structures
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Citação
BÜHLER, R. T.; GIACOMINI, R. Open model for external mechanical stress of semiconductors and MEMS.IEEE International Conference on Microelectronic Test Structures, p. 189-193, March, 2018.
Texto completo (DOI)
10.1109/ICMTS.2018.8383795
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URI
https://repositorio.fei.edu.br/handle/FEI/3787
Resumo
© 2018 IEEE.This paper defines the details of the bending equipment solution and the calibration required for characterization of external mechanical stress in semiconductors and MEMS. The equipment is suited for use in probe station for electrical characterization of devices under controlled external mechanical stress.

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