Semiconductor bending setup for electrical characterization of mechanical stress

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dc.contributor.authorBÜHLER, Rudolf Theoderich
dc.contributor.authorPERIN, A. L.
dc.contributor.authorRenato Giacomini
dc.contributor.authorOrcidhttps://orcid.org/0000-0002-7934-9605
dc.contributor.authorOrcidhttps://orcid.org/0000-0003-1060-2649
dc.date.accessioned2022-01-12T21:57:56Z
dc.date.available2022-01-12T21:57:56Z
dc.date.issued2017-09-01
dc.description.abstract© 2017 IEEE.This work proposes and describes in details a complete setup solution for testing of non-encapsulated electronic devices under mechanical stress. The equipment was implemented and calibrated to later use in electrical characterization of devices, such as MOSFETs and diodes under controlled mechanical stress. The semiconductor bending equipment allows the electrical characterization of devices using already existent probe stations in laboratories without additional modifications, as presented here.
dc.identifier.citationBÜHLER, R. T.; PERIN, A. L.; GIACOMINI, R. Semiconductor bending setup for electrical characterization of mechanical stress. INSCIT 2017 - 2nd International Symposium on Instrumentation Systems, Circuits and Transducers: Chip on the Sands, Proceedings, Sept. 2017.
dc.identifier.doi10.1109/INSCIT.2017.8103520
dc.identifier.urihttps://repositorio.fei.edu.br/handle/FEI/3828
dc.relation.ispartofINSCIT 2017 - 2nd International Symposium on Instrumentation Systems, Circuits and Transducers: Chip on the Sands, Proceedings
dc.rightsAcesso Restrito
dc.subject.otherlanguageElectrical Characterization
dc.subject.otherlanguagemeasurements
dc.subject.otherlanguageMechanical Stress
dc.titleSemiconductor bending setup for electrical characterization of mechanical stress
dc.typeArtigo de evento
fei.scopus.citations0
fei.scopus.eid2-s2.0-85041217966
fei.scopus.subjectElectrical characterization
fei.scopus.subjectElectronic device
fei.scopus.subjectMechanical stress
fei.scopus.subjectMOSFETs
fei.scopus.subjectProbe stations
fei.scopus.updated2024-07-01
fei.scopus.urlhttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85041217966&origin=inward
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