TCAD SIMULATION OF SINGLE EVENT EFFECTS ON ELECTRONIC DEVICES
Carregando...
Arquivos
Citações na Scopus
0
Tipo de produção
Artigo de evento
Data
2022-01-05
Autores
BÜHLER, Rudolf Theoderich
NOVO, C.
PERIN, A. L.
Milene Galeti
PEREIRA, C. F.
Marcilei Aparecida Guazzelli
Giacomini, R.
NOVO, C.
PERIN, A. L.
Milene Galeti
PEREIRA, C. F.
Marcilei Aparecida Guazzelli
Giacomini, R.
Orientador
Periódico
Journal of Physics: Conference Series
Título da Revista
ISSN da Revista
Título de Volume
Citação
BÜHLER, R. T.; NOVO, C.; PERIN, A. L.; GALETI, M.; PEREIRA, C. F.; GUAZZELLI, M. A.; GIACOMINI, R. Tcad simulation of single event effects on electronic devices. Journal of Physics: Conference Series, v. 2340, n. 1, 2022.
Texto completo (DOI)
Palavras-chave
Resumo
© 2022 Institute of Physics Publishing. All rights reserved.In this paper, lateral bulk PIN photodiodes designed at FEI University and SOI (Silicon-on-Insulator) PIN photodiodes from UCL are analyzed as photodetectors and SEE (Single Event Effects) sensors. Numerical simulations are used for radiation analysis of heavy ion striking the PIN photodiode using the parameters extracted by real measurements in a non-radiation condition. The occurrence of SEE near-Earth natural environment is unpredictable and is a serious threat that can lead to malfunctions of microprocessors, memory banks and devices that are vital to the correct behavior of a low-orbit or avionic mission. Detecting their occurrence and monitoring the energetic particles in radiation environments is vital and this paper investigates the consequence of SEE on lateral PIN photodiodes through experimentally calibrated TCAD numerical simulations.