Artigos
URI permanente para esta coleçãohttps://repositorio.fei.edu.br/handle/FEI/798
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- Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K(2017) Paz B.C.; Doria R.T.; Casse M.; Barraud S.; Reimbold G.; Vinet M.; Faynot O.; Pavanello M.A.© 2017 Elsevier LtdThe linearity of triple gate nanowire transistors (NWs) implemented on a Silicon-On-Insulator (SOI) substrate is investigated in this work considering temperature (T) influence. The analysis is performed in long channel nanowire MOSFETs with different fin width (WFIN), from quasi-planar structures (WFIN = 10 μm) to narrow devices (9.5 nm), operating as single-transistor amplifiers from room temperature down to 100 K. The total, second and third order harmonic distortions (THD, HD2 and HD3, respectively) are extracted using the Integral Function Method (IFM). The analysis is divided in two parts. First, a fixed input signal is applied at the gate of the single-transistor amplifiers and, then, the output signal is fixed. Transport parameters such as effective mobility (μeff), mobility degradation coefficient (θ) and series resistance (RS) have been extracted down to 100 K and correlated to the distortion to explain linearity peaks behavior with temperature and fin width. Narrow transistors have shown improved linearity mainly due to higher intrinsic voltage gain (AV) considering the entire temperature range. Low temperature operation has shown to degrade the linearity characteristics of both wide and narrow NW MOSFETs.
- Compact modeling of triple gate junctionless MOSFETs for accurate circuit design in a wide temperature range(2019) Pavanello M.A.; Cerdeira A.; Doria R.T.; Ribeiro T.A.; Avila-Herrera F.; Estrada M.© 2019 Elsevier LtdThis paper presents the extension of proposed physically-based continuous compact analytical model of triple gate junctionless nanowire transistors for accurate description of device electrical characteristics in a wide temperature range from room temperature up to 500 K. The model validation is performed by comparison against tridimensional numerical simulation and experimental data showing very good agreement, with continuous description of drain current and its derivatives in all regions of operation and temperatures.
- Drain current model for short-channel triple gate junctionless nanowire transistors(2016) Paz B.C.; Casse M.; Barraud S.; Reimbold G.; Faynot O.; Avila-Herrera F.; Cerdeira A.; Pavanello M.A.© 2016 Elsevier LtdThis work proposes a numerical charge-based new model to describe the drain current for triple gate junctionless nanowire transistors (3G JNT). The drain current is obtained through a numerical integration of a single expression that physically describes the junctionless charge density in both accumulation and depletion regimes of operation, leading to a continuous model in all operational regions. The triple gate structure is modeled from an evolution of a previous model designed for double gate junctionless nanowire transistors (2G JNT). Improvements concerning the capacitance coupling, the internal potential changing while reducing the fin height in nanowire transistors and higher immunity to short-channel effects (SCE) are considered. The model validation is performed through both tridimensional numerical simulation and experimental measurements for long and short-channel devices. Through simulated results, it is verified the agreement of the modeled curves for junctionless transistors with different values of fin height. Comparison between the proposed model and experimental data is performed for 3G JNT advanced structures with channel length down to 15 nm and fin height of 8 nm. Results for 3G JNTs with different values of doping concentration and channel width are also displayed showing a good agreement as well. Moreover, 3G JNT performance is also analyzed and compared in the studied structures by extracting the threshold voltage (VTH), subthreshold slope (S), DIBL and model parameters.
- An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices(2012) Trevisoli R.D.; Martino J.A.; Simoen E.; Claeys C.; Pavanello M.A.Triple-gate devices are considered a promising solution for sub-20 nm era. Strain engineering has also been recognized as an alternative due to the increase in the carriers mobility it propitiates. The simulation of strained devices has the major drawback of the stress non-uniformity, which cannot be easily considered in a device TCAD simulation without the coupled process simulation that is time consuming and cumbersome task. However, it is mandatory to have accurate device simulation, with good correlation with experimental results of strained devices, allowing for in-depth physical insight as well as prediction on the stress impact on the device electrical characteristics. This work proposes the use of an analytic function, based on the literature, to describe accurately the strain dependence on both channel length and fin width in order to simulate adequately strained triple-gate devices. The maximum transconductance and the threshold voltage are used as the key parameters to compare simulated and experimental data. The results show the agreement of the proposed analytic function with the experimental results. Also, an analysis on the threshold voltage variation is carried out, showing that the stress affects the dependence of the threshold voltage on the temperature. © 2011 Elsevier Ltd. All rights reserved.
- Charge-based compact analytical model for triple-gate junctionless nanowire transistors(2016) Avila-Herrera F.; Paz B.C.; Cerdeira A.; Estrada M.; Pavanello M.A.© 2016 Elsevier Ltd.A new compact analytical model for short channel triple gate junctionless transistors is proposed. Based on a previous model for double-gate transistors which neglected the fin height effects, a new 3-D continuous model has been developed, including the dependence of the fin height and the short channel effects. An expression for threshold voltage is presented. The model defines a one-dimensional semiconductor effective capacitance due to the width and the height of the fin, which in turn redefines the potentials and charges, without altering the general modeling procedure. Threshold voltage roll-off, subthreshold slope, DIBL and channel length modulation, as well as, the mobility degradation and the velocity saturation have been introduced into the model. The validation was done by 3-D numerical simulations for different fin heights and channel lengths, as well as, by experimental measurements in nanowire transistors with doping concentrations of 5 × 1018 and 1 × 1019 cm-3. The developed model is suitable for describing the current-voltage characteristics in all operating regions from double-gate to nanowire transistor with only 8 adjusting parameters.
- Analysis of temperature variation influence on the analog performance of 45° rotated triple-gate nMuGFETs(2012) Pavanello M.A.; Souza M.D.; Martino J.A.; Simoen E.; Claeys C.This work presents the analog performance of n-type triple-gate MuGFETs with high-k dielectrics and TiN gate material fabricated in 45° rotated SOI substrates comparing their performance with standard MuGFETs fabricated without substrate rotation. Different fin widths are studied for temperatures ranging from 250 K up to 400 K. The results of transconductance, output conductance, transconductance over drain current ratio, intrinsic voltage gain and unit-gain frequency are studied. It is observed that the substrate rotation improves the carrier mobility of narrow MuGFETs at any temperature because of the changing in the conduction plane at the sidewalls from (1 1 0) to (1 0 0). For lower temperatures, the improvement of the carrier mobility of rotated MuGFETs is more noticeable as well as the rate of mobility improvement with the temperature decrease is larger. The output conductance is weakly affected by the substrate rotation. Although this improvement in the transconductance of rotated MuGFETs is negligibly transferred to the intrinsic voltage gain, the unity-gain frequency of rotated device is improved due to the larger carrier mobility in the entire range of temperatures studied. © 2011 Elsevier Ltd. All rights reserved.
- Analog performance of standard and strained triple-gate silicon-on-insulator nFinFETs(2008) Pavanello M.A.; Martino J.A.; Simoen E.; Rooyackers R.; Collaert N.; Claeys C.This work shows a comparison between the analog performance of standard and strained Si n-type triple-gate FinFETs with high-κ dielectrics and TiN gate material. Different channel lengths and fin widths are studied. It is demonstrated that both standard and strained FinFETs with short channel length and narrow fins have similar analog properties, whereas the increase of the channel length degrades the early voltage of the strained devices, consequently decreasing the device intrinsic voltage gain with respect to standard ones. Narrow strained FinFETs with long channel show a degradation of the Early voltage if compared to standard ones suggesting that strained devices are more subjected to the channel length modulation effect. © 2008 Elsevier Ltd. All rights reserved.