Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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8 resultados
Resultados da Pesquisa
- Threshold voltages of SOI MuGFETs(2008-12-05) de Andrade M.G.C.; Martino J.A.The multiple-gate field-effect transistor (MuGFET) is a device with a gate folded on different sides of the channel region. They are one of the most promising technological solutions to create high-performance ultra-scaled SOI CMOS. In this work, the behavior of the threshold voltage in double-gate, triple-gate and quadruple-gate SOI transistors with different channel doping concentrations is studied through three-dimensional numerical simulation. The results indicated that for double-gate transistors, one or two threshold voltages can be observed, depending on the channel doping concentration. However, in triple-gate and quadruple-gate it is possible to observe up to four threshold voltages due to the corner effect and the different doping concentration between the top and bottom of the Fin. © 2008 Elsevier Ltd. All rights reserved.
- Impact of SEG on uniaxially strained MuGFET performance(2011-05-05) Paula Agopian; PACHECO, V. H.; MARTINO J. A.; SIMOEN, E.; CLAEYS, C.This work focuses on the impact of the source and drain Selective Epitaxial Growth (SEG) on the performance of uniaxially strained MuGFETs. With the channel length reduction, the normalized transconductance (gm.L/W) of unstressed MuGFETs decreases due to the series resistance and short channel effects (SCE), while the presence of uniaxial strain improves the gm. The competition between the series resistance (Rs) and the uniaxial strain results in a normalized gm maximum point for a specific channel length. Since the SEG structure influences both Rs and the strain in the channel, this work studies from room down to low temperature how these effects influence the performance of the triple-gate FETs. For lower temperatures, the strain-induced mobility enhancement increases and leads to a shift in the maximum point towards shorter channel lengths for devices without SEG. This shift is not observed for devices with SEG where the strain level is much lower. At 150 K the gm behavior of short channel strained devices with SEG is similar to the non SEG ones due to the better gm temperature enhancement for devices without SEG caused by the strain. For lower temperatures SEG structure is not useful anymore. © 2011 Elsevier Ltd. All rights reserved.
- Different stress techniques and their efficiency on triple-gate SOI n-MOSFETs(2015) Buhler R.T.; Agopian P.G.D.; Collaert N.; Simoen E.; Claeys C.; Martino J.A.© 2014 Elsevier Ltd. All rights reserved.Three techniques to implement mechanical stress in n-channel Multiple Gate MOSFETs (MuGFETs) are investigated through 3D simulations and transconductance measurements. They are: uniaxial stress, biaxial stress and biaxial + uniaxial stress. Four different fin dimensions are evaluated: a narrow and a wide transistor, combined with a short or a long device. It is shown that the stress distribution and the device performance exhibit a dependence on the fin dimensions. For uniaxially strained devices, the dimensions are important as the bending of the silicon required to induce stress in the channel depends on its size. However, for biaxially strained devices the plane of etching in the silicon fin is important, determining the degradation of the stress components. The combination of the two types of stress results in an improvement of some stress components and an overall improvement in the maximum transconductance.
- Compact modeling of triple gate junctionless MOSFETs for accurate circuit design in a wide temperature range(2019) Pavanello M.A.; Cerdeira A.; Doria R.T.; Ribeiro T.A.; Avila-Herrera F.; Estrada M.© 2019 Elsevier LtdThis paper presents the extension of proposed physically-based continuous compact analytical model of triple gate junctionless nanowire transistors for accurate description of device electrical characteristics in a wide temperature range from room temperature up to 500 K. The model validation is performed by comparison against tridimensional numerical simulation and experimental data showing very good agreement, with continuous description of drain current and its derivatives in all regions of operation and temperatures.
- Charge-based compact analytical model for triple-gate junctionless nanowire transistors(2016) Avila-Herrera F.; Paz B.C.; Cerdeira A.; Estrada M.; Pavanello M.A.© 2016 Elsevier Ltd.A new compact analytical model for short channel triple gate junctionless transistors is proposed. Based on a previous model for double-gate transistors which neglected the fin height effects, a new 3-D continuous model has been developed, including the dependence of the fin height and the short channel effects. An expression for threshold voltage is presented. The model defines a one-dimensional semiconductor effective capacitance due to the width and the height of the fin, which in turn redefines the potentials and charges, without altering the general modeling procedure. Threshold voltage roll-off, subthreshold slope, DIBL and channel length modulation, as well as, the mobility degradation and the velocity saturation have been introduced into the model. The validation was done by 3-D numerical simulations for different fin heights and channel lengths, as well as, by experimental measurements in nanowire transistors with doping concentrations of 5 × 1018 and 1 × 1019 cm-3. The developed model is suitable for describing the current-voltage characteristics in all operating regions from double-gate to nanowire transistor with only 8 adjusting parameters.
- Analysis of temperature variation influence on the analog performance of 45° rotated triple-gate nMuGFETs(2012) Pavanello M.A.; Souza M.D.; Martino J.A.; Simoen E.; Claeys C.This work presents the analog performance of n-type triple-gate MuGFETs with high-k dielectrics and TiN gate material fabricated in 45° rotated SOI substrates comparing their performance with standard MuGFETs fabricated without substrate rotation. Different fin widths are studied for temperatures ranging from 250 K up to 400 K. The results of transconductance, output conductance, transconductance over drain current ratio, intrinsic voltage gain and unit-gain frequency are studied. It is observed that the substrate rotation improves the carrier mobility of narrow MuGFETs at any temperature because of the changing in the conduction plane at the sidewalls from (1 1 0) to (1 0 0). For lower temperatures, the improvement of the carrier mobility of rotated MuGFETs is more noticeable as well as the rate of mobility improvement with the temperature decrease is larger. The output conductance is weakly affected by the substrate rotation. Although this improvement in the transconductance of rotated MuGFETs is negligibly transferred to the intrinsic voltage gain, the unity-gain frequency of rotated device is improved due to the larger carrier mobility in the entire range of temperatures studied. © 2011 Elsevier Ltd. All rights reserved.
- Analog performance of standard and strained triple-gate silicon-on-insulator nFinFETs(2008) Pavanello M.A.; Martino J.A.; Simoen E.; Rooyackers R.; Collaert N.; Claeys C.This work shows a comparison between the analog performance of standard and strained Si n-type triple-gate FinFETs with high-κ dielectrics and TiN gate material. Different channel lengths and fin widths are studied. It is demonstrated that both standard and strained FinFETs with short channel length and narrow fins have similar analog properties, whereas the increase of the channel length degrades the early voltage of the strained devices, consequently decreasing the device intrinsic voltage gain with respect to standard ones. Narrow strained FinFETs with long channel show a degradation of the Early voltage if compared to standard ones suggesting that strained devices are more subjected to the channel length modulation effect. © 2008 Elsevier Ltd. All rights reserved.
- Evaluation of triple-gate FinFETs with SiO2-HfO2-TiN gate stack under analog operation(2007) Marcelo Antonio Pavanello; MARTINO, J. A.; SIMOEN, E.; ROOYACKERS, R.; COLLAERT, N.; CLAEYS, C.This work presents the analog performance of nMOS triple-gate FinFETs with high-κ dielectrics, TiN gate material and undoped body from DC measurements. Different fin widths and devices with and without halo implantation are explored. No halo FinFETs can achieve extremely large gain and improved unity gain frequency at similar channel length than halo counterparts. The FinFETs with 110 nm long channel achieve an intrinsic gain of 25 dB. Extremely large Early voltages have been measured on long channel nMOS with no halo and relatively wide fins compared to the results usually reported in the literature. The large Early voltage obtained suggests that the devices operate in the onset of volume inversion due to the low doping level of the device body. © 2007 Elsevier Ltd. All rights reserved.