Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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5 resultados
Resultados da Pesquisa
- Impact of series resistance on the drain current variability in inversion mode and junctionless nanowire transistors(2023-10-05) SILVA, L. M. B. DA; Marcelo Antonio Pavanello; CASSÉ, M.; BARRAUD, S.; VINET, M.; FAYNOT, O.; Michelly De Souza© 2023 Elsevier LtdThis work analyzes the influence of source-drain series resistance variability over the drain current in junctionless and inversion mode nanowire transistors. A comparison between drain current and Y-function variability is presented using experimental data of nanowires with different widths and channel lengths. The source-drain series resistance variability is also presented. The results indicates that source-drain series resistance influence is higher on drain current variability for junctionless than inversion mode nanowire transistors.
- Experimental Demonstration of Ω-Gate SOI Nanowire MOS Transistors' Mobility Variation Induced by Substrate Bias(2022) BERMAMASCHI, F. E.; RIBEIRO, T. A.; PAZ, B. C.; Michelly De Souza; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 1963-2012 IEEE.This work investigates the carrier mobility variation in Ω-gate silicon-on-insulator (SOI) nanowire MOS transistors induced by substrate (or back) biasing. The analysis is carried out through experimental measurements and 3-D TCAD simulation, performed in n-type devices with variable fin width. Mobility enhancement is observed for lower back bias levels, due to the initial conduction through the Si-BOX interface, which presents higher mobility, prior to the activation of the front channel. As back bias is increased, however, the strong substrate-induced electric field in the back channel (BC) is responsible for worsening scattering mechanisms in the BC, such as surface roughness and acoustic phonon scattering, inducing mobility degradation. The effect is amplified as the fin width increases. For short-channel devices, the use of back bias was more beneficial for mobility due to a stronger mobility enhancement and lower mobility degradation.
- High Temperature and Width Influence on the GIDL of Nanowire and Nanosheet SOI nMOSFETs(2023-01-05) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Pavanello M. A.AuthorIn this work, an experimental evaluation of Gate-Induce Drain Leakage (GIDL) current is presented for nanowire and nanosheet-based SOI transistors. The effects of fin width and temperature increase are studied. Obtained results indicate that the increase in device width makes the GIDL current more sensitive to temperature increase. Three-dimensional numerical simulations have shown that despite the reverse junction leakage increase with temperature, leakage current in nanosheet and nanowire transistors is composed predominantly of GIDL current. The change in valence and conduction bands caused by temperature increase favors the band-to-band tunneling, which is responsible for the worsening of GIDL at high temperatures.
- Analysis of the Gate-Induced Drain Leakage of SOI Nanowire and Nanosheet MOS Transistors at High Temperatures(2022-07-04) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.This work presents a comparison between the Gate-Induced Drain Leakage (GIDL) current of the nanowire (tri-gate MOSFET with narrow fin width) and nanosheet (tri-gate MOSFET with wide fin width) SOI MOSFETs at high temperatures, in the range between 300 K and 580 K. The study is conducted using experimental data, corroborated with 3D TCAD simulations. It is demonstrated that the GIDL current normalized by the total fin width is larger in nanosheet MOSFET than for the nanowire at high temperatures. Additionally, the nanosheet device presents a larger variation of the normalized GIDL current with the temperature than the nanowire one.
- A New Method for Series Resistance Extraction of Nanometer MOSFETs(2017-07-05) TREVISOLI, R.; Rodrido Doria; Michelly De Souza; BARRAUD, S.; VINET, M.; CASSE, M.; REIMBOLD, G.; FAYNOT, O.; GHIBAUDO, G.; Marcelo Antonio PavanelloThis paper presents a new method for the series resistance extraction in ultimate MOSFETs using a single drain current versus gate voltage characteristic curve. The method is based on the Y-function curve, such that the series resistance is obtained through the curve of the total resistance as a function of the inverse of the Y-function. It includes both first-and second-order mobility degradation factors. To validate the proposed method, numerical simulations have been performed for devices of different characteristics. Besides, the method applicability has been demonstrated for experimental silicon nanowires and FinFETs. Apart from that, devices with different channel lengths can be used to estimate the mobility degradation factor influence.