Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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4 resultados
Resultados da Pesquisa
- Analog performance improvement of self-cascode structures composed by UTBB transistors using back gate bias(2015-11-20) Rodrido Doria; TREVISOLI, R.; Michelly De Souza; Marcelo Antonio Pavanello; FLANDRE, D.This paper explores the use of the back gate bias to enhance the analog performance of self-cascode structures composed by 25nm-long UTBB SOI MOSFETs. It is shown, for the first time, that the use of back gate bias can improve the intrinsic voltage gain by 15 dB, making it larger than the one presented by a 50nm-long single device.
- Use of back gate bias to improve the performance of n- and p-type UTBB transistors-based self-cascode structures applied to current mirrors(2017-10-10) Rodrido Doria; TREVISOLI, R.; Michelly De Souza; Marcelo Antonio Pavanello; FLANDRE, D.This paper aims at demonstrating, for the first time, the use of back bias to improve the analog performance of current mirrors composed by self-cascode structures with 25 nm-long n- and p-type UTBB SOI MOSFETs. The use of back gate bias has shown to enhance the intrinsic gain of p-type devices by about 7 dB, making it higher than the one from a single device with equivalent channel length whereas the mirroring precision has shown to be improved by 20 % with respect to single devices.
- Analysis of the output conductance degradation with the substrate bias in SOI UTB and UTBB transistors(2018-08-31) FERNO COSTA, J.; TREVISOLI, R.; Rodrigo Doria© 2018 IEEE.The goal of this work is to present the behavior of the output conductance in Ultra-Thin Body (UTB) and Ultra-Thin Body and Buried Oxide (UTBB) SOI {MOSFETs with the application of a selected set of back gate biases (VSUB) through AC simulations, in devices with and without considering the effect of the ground plane. It has been shown that the output conductance degradation due to self-heating and substrate effects increases as the substrate bias is reduced. The output conductance degradation by self-heating presents a reduction of about 52% and by substrate effects of 57% by simply increasing the back bias from-2V up to 2 V.
- Analysis of the Thermal Properties of Self-Cascode Structures Composed by UTBB Transistors(2020) COSTA, F. J.; TREVISOLI, R.; Michelly De Souza; Rodrigo Doria© 2020 IEEE.The focus of this work is to perform an analysis of the thermal properties of the Self-Cascode (SC) structure composed by advanced UTBB SOI MOSFETs under a selected set of back gate biases, through 2D numerical simulations. In this work, it could be observed that the SC structure presents a 50 % lower thermal resistance in comparison with a single device with similar channel length. The application of a back gate bias of 2 V to the drain-sided device or -2 V to the source-sided devices of the SC has shown a decrease of 10-16 % in the thermal resistance.