Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
Navegar
5 resultados
Resultados da Pesquisa
- Strain effectiveness dependence on fin dimensions and shape for n-type triple-gate MuGFETs(2011-09-02) BÜHLER, Rudolf Theoderich; Renato Giacomini; AGOPIAN, P. G. D.; MARTINO, J. A.We analyze in this work, for the first time, the effectiveness and the dependence of the induced uniaxial stress on process variables, using the CESL technique on n-type MuGFETs thought 3D simulations. The fin cross-section shape variation is also included with a complete study on the stress distribution and the electric characterization of the device to measure the impact on its performance. The stress distribution and the device performance exhibited dependence with the shape and fin dimensions, with longer and taller inverse trapezium fin possessing better stress and DC characteristics, and better AC performance on the regular trapezium. ©The Electrochemical Society.
- Uniaxial stress efficiency for different fin dimensions of triple-gate SOI nMOSFETs(2011-10-06) BÜHLER, Rudolf Theoderich; AGOPIAN, P. G. D.; Renato Giacomini; SIMOEN, E.; CLAEYS, C.; MARTINO, J. A.The stress profiles extracted showed that the variation in the silicon fin dimensions influence the stress levels and distributions along the silicon fin. From the analog performance view, these variations in the stress have influence on some electric parameters. The reduction of the total fin length showed no significant change in the parameters, although a reduction in the stress level was noticed, leading to the conclusion that the shift in the stress level is too small to cause a pronounced impact on the parameters. On the other hand, the reduction of the silicon fin height showed more interesting results. Despite that the standard device with smaller fin height presented a lower intrinsic voltage gain performance when compared to the reference device, when implementing strain it supersedes the reference device and presented an enhancement in the intrinsic voltage gain over the standard one up to 8 %, larger than the 5.1 % obtained for the reference device. © 2011 IEEE.
- Biaxial stress simulation and electrical characterization of triple-gate SOI nMOSFETs(2012-09-02) BÜHLER, Rudolf Theoderich; AGOPIAN, P. G. D.; SIMOEN. E.; CLAEYS, C.; MARTINO, J. A.In this work we study unstrained and biaxially strained triple-gate SOI nMOSFETs by process and device numerical simulations and by electrical characterization. Emphasis is given to the total resistance and transconductance in devices with and without SEG (selective epitaxial growth) and variable fin dimensions. The influence of the fin dimensions on the stress effectiveness is analyzed through 3D process simulations, while the total resistance and transconductance are analyzed through dc measurements. The use of biaxial stress combined with the SEG technique resulted in an lower total resistance and a higher maximum transconductance. © The Electrochemical Society.
- Biaxial + uniaxial stress effectiveness in tri-gate SOI nMOSFETs with variable fin dimensions(2012-10-04) BÜHLER, Rudolf Theoderich; Agopian P.G.D.; Simoen E.; Claeys C.; Martino J.A.MuGFET devices show good gate-to-channel control, reducing short channel effects and increased current drive [1] and their performance can be improved through implementation of mechanical stress in the silicon fin. In th is wor k we study t he stress distr ibution and transconductance behavior in unstrained and biaxially + uniaxially strained tri-gate SOI nMOSFETs with different fin dimensions through electrical characterization of experimental devices and 3D process and device numerical simulation. Experimental results of standard and strained devices were used to validate the simulations. The bi+uni stress technique delivered enhanced maximum transconductance. © 2012 IEEE.
- Fin dimension influence on mechanical stressors in triple-gate SOI nMOSFETs(2013-05-16) BÜHLER, Rudolf Theoderich; SIMOEN, E.; AGOPIAN, P. G. D.; CLAEYS, C.; MARTINO, J. A.This work studies the SiGe SRB and tCESL strained triple-gate SOI nMOSFETs using experimental devices and also process and device numerical simulations. The transconductance and mobility are investigated and analyzed with the strain data obtained from process simulations, including the influence of the fin dimensions on the strain. The use of SiGe SRB and tCESL strain combined resulted in higher strain and higher maximum transconductance. © The Electrochemical Society.