Artigos
URI permanente para esta coleçãohttps://repositorio.fei.edu.br/handle/FEI/798
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Resultados da Pesquisa
- Strain effectiveness dependence on fin dimensions and shape for n-type triple-gate MuGFETs(2011-09-02) BÜHLER, Rudolf Theoderich; Renato Giacomini; AGOPIAN, P. G. D.; MARTINO, J. A.We analyze in this work, for the first time, the effectiveness and the dependence of the induced uniaxial stress on process variables, using the CESL technique on n-type MuGFETs thought 3D simulations. The fin cross-section shape variation is also included with a complete study on the stress distribution and the electric characterization of the device to measure the impact on its performance. The stress distribution and the device performance exhibited dependence with the shape and fin dimensions, with longer and taller inverse trapezium fin possessing better stress and DC characteristics, and better AC performance on the regular trapezium. ©The Electrochemical Society.
- Impact of proton irradiation on strained triple gate SOI p- and n-MOSFETs(2011-09-23) AGOPIAN, P. G. D.; MARTINO, J. A.; KOBAYASHI, D.; SIMOEN, E.; CLAEYS, C.In this work the proton irradiation influence on basic and analog parameters of triple-gate SOI MOSFETs is investigated. The studied devices are strained and unstrained p- and nMuGFETs. The type of stress considered in each case, was the stress that results in a better performance of p- (CESL) and n-devices (sSOI+CESL). Although the results showed the worse behavior for post-irradiated nMOS transistors, a higher immunity to the back interface influence was obtained for post-irradiated pMOS devices and consequently a better analog performance was observed. The unit gain frequency improved for p and nMOS post-irradiated devices. © 2011 IEEE.
- Uniaxial stress efficiency for different fin dimensions of triple-gate SOI nMOSFETs(2011-10-06) BÜHLER, Rudolf Theoderich; AGOPIAN, P. G. D.; Renato Giacomini; SIMOEN, E.; CLAEYS, C.; MARTINO, J. A.The stress profiles extracted showed that the variation in the silicon fin dimensions influence the stress levels and distributions along the silicon fin. From the analog performance view, these variations in the stress have influence on some electric parameters. The reduction of the total fin length showed no significant change in the parameters, although a reduction in the stress level was noticed, leading to the conclusion that the shift in the stress level is too small to cause a pronounced impact on the parameters. On the other hand, the reduction of the silicon fin height showed more interesting results. Despite that the standard device with smaller fin height presented a lower intrinsic voltage gain performance when compared to the reference device, when implementing strain it supersedes the reference device and presented an enhancement in the intrinsic voltage gain over the standard one up to 8 %, larger than the 5.1 % obtained for the reference device. © 2011 IEEE.
- Fin width influence on uniaxial stress of triple-gate SOI nMOSFETs(2012-03-17) BÜHLER, Rudolf Theoderich; MARTINO, J. A.; AGOPIAN, P. G. D.; Renato GiacominiThis work analyzes the fin width dependence on induced uniaxial stress on n-type MuGFETs thought 3D simulations. A study on the stress distribution and the electric characterization of the device to measure the impact on its performance is accomplished. The stress distribution and the device performance exhibited dependence on the fin width, with higher stress transfer for narrower fins resulting in better electrical performance. © 2012 IEEE.
- Fin dimension influence on mechanical stressors in triple-gate SOI nMOSFETs(2013-05-16) BÜHLER, Rudolf Theoderich; SIMOEN, E.; AGOPIAN, P. G. D.; CLAEYS, C.; MARTINO, J. A.This work studies the SiGe SRB and tCESL strained triple-gate SOI nMOSFETs using experimental devices and also process and device numerical simulations. The transconductance and mobility are investigated and analyzed with the strain data obtained from process simulations, including the influence of the fin dimensions on the strain. The use of SiGe SRB and tCESL strain combined resulted in higher strain and higher maximum transconductance. © The Electrochemical Society.