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URI permanente para esta coleçãohttps://repositorio.fei.edu.br/handle/FEI/798

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Agora exibindo 1 - 6 de 6
  • Artigo de evento 3 Citação(ões) na Scopus
    3D simulation of Triple-Gate MOSFETs
    (2010-05-19) CONDE, J.; CERDEIRA, A.; Marcelo Antonio Pavanello; KILCHYTSKA, V.; FLANDRE, D.
    In this paper we present a new approach of analyzing 3D structure for Triple-Gate MOSFETs with three different mesh regions, one at the top and two in the sidewalls of the fin, which allows the consideration of different carrier mobility at each region due to the crystalline orientation and technological processing. A procedure for the extraction of the mobility parameters in each region is developed. Validation of the proposed structure was made for a FinFET arrays with fixed channel length and different fin widths, obtaining a very good coincidence between experimental and simulated characteristics. © 2010 IEEE.
  • Artigo de evento 4 Citação(ões) na Scopus
    Analog performance of submicron GC SOI MOSFETs
    (2012-03-17) NEMER J. P.; Michelly De Souza; Marcelo Antonio Pavanello; FLANDRE, D.
    This paper aims to demonstrate the performance of GC SOI MOSFET devices in comparison to standard SOI MOS transistors, comparing the improvements achieved by the adoption of the GC architecture in a submicron fully depleted SOI technology varying the channel length. The results obtained by two-dimensional numerical simulations show that the best improvement is obtained when the length of lightly doped region length is approximately 100 nm, independently of the total channel length. © 2012 IEEE.
  • Artigo de evento 5 Citação(ões) na Scopus
    Liquid helium temperature analog operation of asymmetric self-cascode FD SOI MOSFETs
    (2012-10-04) Michelly De Souza; KILCHTYSKA, V.; FLANDRE, D.; Marcelo Antonio Pavanello
    Fully Depleted (FD) SOI technology is well known to provide improved analog performance of CMOS transistors [1, 2]. However, FD SOI transistors may suffer from parasitic bipolar effects (PBE) that cause the degradation of the output conductance [3]. The use of cascode transistors with common gate (making a self-cascode-SC topology) has been shown to reduce the output conductance of MOSFETs, while keeping some advantages of long-channel transistors [4]. Fig. 1 represents the self-cascode transistor, composed by transistors MS and MD, with channel lengths LS and LD, and threshold voltages VT, S and VT, D, respectively (with VT, S = VT, D in the symmetric SC-S-SC). Recent works [5, 6] showed that the use of different threshold voltages (VT) for MS and MD (so-called asymmetric self-cascode-A-SC) is able to further enhance the analog properties of SC n-and pMOS transistors, in comparison to the S-SC, at room temperature (RT). In this paper the enhanced analog performance of asymmetric SC structure is experimentally demonstrated at deep cryogenic environments emphasizing its capability to minimize (or even suppress) PBE in FD SOI n-and p-type MOSFETs at liquid helium temperature (LHT), where this effect is more pronounced [7]. © 2012 IEEE.
  • Artigo de evento 2 Citação(ões) na Scopus
    Low frequency noise in submicron Graded-Channel SOI MOSFETs
    (2013-09-06) NEMER, J. P.; Michelly De Souza; FLANDRE, D.; Marcelo Antonio Pavanello
    The origin of the low-frequency noise in submicron fully depleted Graded-Channel (GC) SOI MOSFET is investigated in terms of the channel length comparing two different technologies, OKI semiconductors and UCL. © 2013 IEEE.
  • Artigo de evento 0 Citação(ões) na Scopus
    Analog behavior of submicron graded-Channel SOI MOSFETs varying the channel length, doping concentration and temperature
    (2013-05-16) NEMER, J. P.; Michelly De Souza; FLANDRE, D.; Marcelo Antonio Pavanello
    In this paper the analog performance of Graded-Channel (GC) SOI nMOSFETs with deep submicrometer channel length is presented. Experimental data of GC transistors fabricated in an industrial 150 nm fully-depleted SOI technology from OKI Semiconductors were used to adjust the two-dimensional numerical simulations, in order to analyze the devices analog behavior by extrapolating their physical parameters. The obtained results show that the larger intrinsic voltage gain improvement occurs when the length of the lightly doped region is approximately 100 nm regardless the total channel length, doping concentration and temperature. © The Electrochemical Society.
  • Artigo de evento 0 Citação(ões) na Scopus
    Effect of high temperature on analog parameters of Asymmetric Self-Cascode SOI nMOSFETs
    (2014-10-29) D'OLIVEIRA, L. M.; FLANDRE, D.; Marcelo Antonio Pavanello; Michelly De Souza
    This paper presents an analysis on the high temperature operation of Silicon-on-Insulator (SOI) nMOSFETs in Asymmetric Self-Cascode (A-SC) configuration. For this analysis, experimental results in the range of 300K to 500K of A-SC structures with different channel lengths for both the drain side transistor (MD) and source side transistor (MS) are used. The effect of varying channel length under high temperatures on the A-SC association is evaluated using as figure of merit important analog parameters, such as the intrinsic voltage gain and transconductance over drain current ratio.