Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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6 resultados
Resultados da Pesquisa
- Ultra-Low-Power Diodes Composed by SOI UTBB Transistors(2022-07-04) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to present an analysis of the performance of Ultra-Thin-Body and Buried Oxide transistors working as Ultra-Low-Power diodes. The implementation of different ground planes and substrate biases are analyzed. It is shown a reduced leakage current and increased ratio between the on and off-state currents for the Ultra-Low-Power diode with the N-substrate biased at -2V. However, this condition results in increased threshold voltage. The ground planes do not provoke a significant change in the leakage current, but a noticeable variation can be observed in the ratio between the on and off-state currents due to the higher threshold voltage in relation to the system without ground plane.
- Standard MOS Diodes Composed by SOI UTBB Transistors(2022-08-05) COSTA, F. J.; TREVISOLI, R.; CAPOVILLA, C. E.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to present an analysis of the performance of UTBB SOI transistors working as standard diodes, where the implementation of ground planes and substrate bias are analyzed. It is shown a reduced leakage current and increased ratio between the on and off-state currents with the substrate bias at -2 V and with a P-type GP implemented. However, both conditions result in increased threshold voltage.
- SOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes(2022-03-01) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to carry out an analysis of the effects of cross-coupling in a system composed of SOI UTBB MOSFETs in ultimate integration nodes through numerical simulations, validated with experimental data from literature. In this analysis, it could be observed that two devices located on the channel length direction provoke a reduced cross-coupling on each other. For devices located at distances below 50 nm, a capacitive parasitic coupling between the devices can be observed along with the thermal coupling effect.
- Cross-coupling effects in common-source current mirrors composed by UTBB transistors(2022) JOSÉ DA COSTA, F.; TREVISOLI, R.; Rodrigo Doria© 2022 Elsevier LtdThis work performs an analysis of the cross-coupling effects influence on the performance of current mirrors composed by advanced UTBB SOI MOSFETs through 3D numerical simulations validated to experimental data of single devices. It is shown the presence of a capacitive coupling acting in the system, which can be demonstrated through the threshold voltage reduction at small distances between devices. Additionally, the temperature rise in the system due to the thermal coupling provokes a decrease in the input current as the devices become closer to each other. This is responsible for an increase of 3 % on ID2/ID1 ratio when the devices are biased at the same time and when the distance between them is lowered to 100 nm.
- On the origin of low-frequency noise of submicron Graded-Channel fully depleted SOI nMOSFETs(2015-08-31) MOLTO, A. R.; Rodrigo Doria; Michelly De Souza; Marcelo Antonio PavanelloThis paper deals with the Low-Frequency Noise (LFN) behavior of submicron Graded-Channel SOI nMOSFETs, fabricated in a 150 nm Technology from Oki Semiconductors as a continuation from previous works, looking at the noise sources of these devices. The effects of channel length reduction and gate bias dependence on the LFN of devices biased in linear regime are investigated. The effective trap density and the KF constant, which can be used in BSIM SPICE-like models, are determined.
- Thermal cross-coupling effects in side-by-side UTBB-FDSOI transistors(2021-11-05) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2021 Elsevier LtdThe focus of this work is to perform a first-time analysis of the thermal cross-coupling of a device on a neighbor one in advanced UTBB transistors through 3D numerical simulations, validated with experimental data from the literature. In this work, it could be observed that the temperature rise due to a self-heated device can affect the performance of a neighbor one according to the distance between them and to the bias conditions. By varying the distance of the devices from 1 µm to 50 nm, it is shown an influence of the temperature rise due to a self-heated device in threshold voltage, subthreshold swing and in the maximum transconductance as well an increase in the thermal resistance of a neighbor device.