Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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24 resultados
Resultados da Pesquisa
- Impact of series resistance on the drain current variability in inversion mode and junctionless nanowire transistors(2023-10-05) SILVA, L. M. B. DA; Marcelo Antonio Pavanello; CASSÉ, M.; BARRAUD, S.; VINET, M.; FAYNOT, O.; Michelly De Souza© 2023 Elsevier LtdThis work analyzes the influence of source-drain series resistance variability over the drain current in junctionless and inversion mode nanowire transistors. A comparison between drain current and Y-function variability is presented using experimental data of nanowires with different widths and channel lengths. The source-drain series resistance variability is also presented. The results indicates that source-drain series resistance influence is higher on drain current variability for junctionless than inversion mode nanowire transistors.
- Experimental Demonstration of Ω-Gate SOI Nanowire MOS Transistors' Mobility Variation Induced by Substrate Bias(2022) BERMAMASCHI, F. E.; RIBEIRO, T. A.; PAZ, B. C.; Michelly De Souza; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 1963-2012 IEEE.This work investigates the carrier mobility variation in Ω-gate silicon-on-insulator (SOI) nanowire MOS transistors induced by substrate (or back) biasing. The analysis is carried out through experimental measurements and 3-D TCAD simulation, performed in n-type devices with variable fin width. Mobility enhancement is observed for lower back bias levels, due to the initial conduction through the Si-BOX interface, which presents higher mobility, prior to the activation of the front channel. As back bias is increased, however, the strong substrate-induced electric field in the back channel (BC) is responsible for worsening scattering mechanisms in the BC, such as surface roughness and acoustic phonon scattering, inducing mobility degradation. The effect is amplified as the fin width increases. For short-channel devices, the use of back bias was more beneficial for mobility due to a stronger mobility enhancement and lower mobility degradation.
- High Temperature and Width Influence on the GIDL of Nanowire and Nanosheet SOI nMOSFETs(2023-01-05) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Pavanello M. A.AuthorIn this work, an experimental evaluation of Gate-Induce Drain Leakage (GIDL) current is presented for nanowire and nanosheet-based SOI transistors. The effects of fin width and temperature increase are studied. Obtained results indicate that the increase in device width makes the GIDL current more sensitive to temperature increase. Three-dimensional numerical simulations have shown that despite the reverse junction leakage increase with temperature, leakage current in nanosheet and nanowire transistors is composed predominantly of GIDL current. The change in valence and conduction bands caused by temperature increase favors the band-to-band tunneling, which is responsible for the worsening of GIDL at high temperatures.
- Analysis of the Gate-Induced Drain Leakage of SOI Nanowire and Nanosheet MOS Transistors at High Temperatures(2022-07-04) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.This work presents a comparison between the Gate-Induced Drain Leakage (GIDL) current of the nanowire (tri-gate MOSFET with narrow fin width) and nanosheet (tri-gate MOSFET with wide fin width) SOI MOSFETs at high temperatures, in the range between 300 K and 580 K. The study is conducted using experimental data, corroborated with 3D TCAD simulations. It is demonstrated that the GIDL current normalized by the total fin width is larger in nanosheet MOSFET than for the nanowire at high temperatures. Additionally, the nanosheet device presents a larger variation of the normalized GIDL current with the temperature than the nanowire one.
- Comparative Analysis of Transcapacitances in Asymmetric Self-Cascode and Graded-Channel SOI nMOSFETs(2022-07-04) ALVES, C. R.; D'OLIVEIRA, L. M.; Michelly De Souza© 2022 IEEE.This work presents a comparative study of the transcapacitances of asymmetric self-cascode (A-SC) and graded-channel (GC) silicon-on-insulator (SOI) nMOSFETs, by means of two-dimensional numerical simulations. Simulated results show that the gate-to-drain capacitance is smaller for the ASC SOI device if compared to the GC SOI device, despite of the applied VDS.
- Impact of using Octogonal Layout Style in Planar Power MOSFETs(2022-08-22) DA SILVA, G. A.; Salvador Gimenez© 2022 IEEE.Previous studies have already shown that the use of alternative gate shapes for planar and tridimensional MOSFETs are capable of boosting their analog and digital electrical performances and their ionizing radiations robustness. In this scenario, this work has the objective to study the impact of the use of octagonal layout style (OCTO), as the basic cell, to the implementing of the Planar Power MOSFET (PPM). The main results of this paper show that the PPM layouted with OCTO layout styles, as the basic cells, are able to improve the drain saturation current (IDS-sat) about 668%%, in relation to that implemented with conventional rectangular layout style, considering that they present the same gate area and bias conditions. Therefore, this type of layout approach can be considered an alternative layout to improve the electrical performance of PPMs.
- SOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes(2022-03-01) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to carry out an analysis of the effects of cross-coupling in a system composed of SOI UTBB MOSFETs in ultimate integration nodes through numerical simulations, validated with experimental data from literature. In this analysis, it could be observed that two devices located on the channel length direction provoke a reduced cross-coupling on each other. For devices located at distances below 50 nm, a capacitive parasitic coupling between the devices can be observed along with the thermal coupling effect.
- The Second Generation of the Layout Styles for MOSFETs to Further Boosting the Electrical Performance of Analog MOSFETs and CMOS ICs(2021-08-27) GALEMBECK, E.H. S.; SILVA, G. A. D.; Salvador Gimenez©2021 IEEE.This article describes, for the first time, the study of electrical behavior of the first element belonging to the family of Second Generation of layout styles for Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs), entitled Half-Diamond. It was conceived in order to further boosting the electrical performance of the analog MOSFETs in relation to the one found in Diamond MOSFETs (hexagonal gate shape). This innovative layout style has by objective further enhance the Longitudinal Corner Effect (LCE) and mainly the Parallel Connections of MOSFETs with Different Channel Lengths Effect (PAMDLE) by the means of further reducing of the effective channel lengths of Diamond MOSFETs in relation to those measured in the conventional (rectangular gate geometry) ones (RMs). The main results found by the three-dimensional numerical simulations indicates that the Half-Diamond MOSFET (HDM) is able to provide a saturation drain current 13% higher than the one observed in the RM counterpart. Furthermore, the electrical behaviors of LCE, PAMDLE and DEPAMBRE in HDM are analyzed in detail by observing the electrical behavior of the electrostatic potentials, longitudinal electric fields and drain current densities. c2021 IEEE.
- Analysis of Capacitances in Asymmetric SelfCascode SOI nMOSFETs(2021-08-27) ALVES, C.R.; D' OLIVEIRA, L. M.; Michelly De Souza©2021 IEEE.This work presents a study of the capacitance of asymmetric self-cascode silicon-on-insulator (ASC SOI) MOSFETs with similar gate areas and different gate lengths. Experimental results of total gate capacitance of different ASC are presented and complemented with the results of twodimensional simulations. The transcapacitances are explored through two-dimensional simulations. Results show that different channel lengths of the composite transistors have more influence in the depletion region of the capacitance curves for low VDS. The gate-source and gate-drain capacitances show opposite trends with the change in the lengths of source and drain transistors, despite of the VDS applied.
- On the compact modelling of Si nanowire and Si nanosheet MOSFETs(2022) CERDEIRA, A.; ESTRADA, M.; Marcelo Antonio PavanelloIn this paper, three-dimensional technology computer aided design simulations are used to show that the electron concentration, current density, and electric field distribution from the interface at the lateral channels and from the top channel to the centre of the silicon wire, in nanowire and nanosheet structures, are practically same. This characteristic makes it possible to consider that the total channel width for these structures is equal to the perimeter of the transistor sheet, allowing to extend of the application of the symmetric doped double-gate model (SDDGM) model to nanowires and nanosheets metal-oxide-semiconductor field effect transistors, with no need to include new parameters. The model SDDGM is validated for this application using several measured and simulated structures of nanowires and nanosheets transistors, with different aspect ratios of fin width and fin height, showing very good agreement between measured or simulated characteristics and modelled. SDDGM is encoded in Verilog-A language and implemented in the SmartSPICE circuit simulator.
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