Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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10 resultados
Resultados da Pesquisa
- Analysis of Fin Width Influence on the Carrier's Mobility of Nanowire MOSFETs(2021-08-31) CCOTO, C. U. C.; BERGAMASHI, F. E.; Marcelo Antonio Pavanello©2021 IEEE.In this work, the study of the effective electron mobility (peff) of n-channel MOS transistor nanowires is presented. By extracting the mobility of the top and sidewall using the surface current separation technique together with the split-CV method. Analyzing the comparison of simulated TCAD results and experimental transistors fabricated with various fin widths (12nm-82nm) and how the effect of varying the fin width and applied substrate voltages interfere with carrier mobility values.
- Experimental Demonstration of Ω-Gate SOI Nanowire MOS Transistors' Mobility Variation Induced by Substrate Bias(2022) BERMAMASCHI, F. E.; RIBEIRO, T. A.; PAZ, B. C.; Michelly De Souza; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 1963-2012 IEEE.This work investigates the carrier mobility variation in Ω-gate silicon-on-insulator (SOI) nanowire MOS transistors induced by substrate (or back) biasing. The analysis is carried out through experimental measurements and 3-D TCAD simulation, performed in n-type devices with variable fin width. Mobility enhancement is observed for lower back bias levels, due to the initial conduction through the Si-BOX interface, which presents higher mobility, prior to the activation of the front channel. As back bias is increased, however, the strong substrate-induced electric field in the back channel (BC) is responsible for worsening scattering mechanisms in the BC, such as surface roughness and acoustic phonon scattering, inducing mobility degradation. The effect is amplified as the fin width increases. For short-channel devices, the use of back bias was more beneficial for mobility due to a stronger mobility enhancement and lower mobility degradation.
- Analysis of the Gate-Induced Drain Leakage of SOI Nanowire and Nanosheet MOS Transistors at High Temperatures(2022-07-04) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.This work presents a comparison between the Gate-Induced Drain Leakage (GIDL) current of the nanowire (tri-gate MOSFET with narrow fin width) and nanosheet (tri-gate MOSFET with wide fin width) SOI MOSFETs at high temperatures, in the range between 300 K and 580 K. The study is conducted using experimental data, corroborated with 3D TCAD simulations. It is demonstrated that the GIDL current normalized by the total fin width is larger in nanosheet MOSFET than for the nanowire at high temperatures. Additionally, the nanosheet device presents a larger variation of the normalized GIDL current with the temperature than the nanowire one.
- An Experimental Evaluation of Fin Width and Low-Temperature Influence on GIDL in Stacked SOI Nanowires(2022) Michelly De Souza; RODRIGUES, J. C.; MARINIELLO, G.; CASSE, M.; BARRAUD, S.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.In this work, an experimental evaluation of the gate-induced drain leakage (GIDL) of vertically stacked SOI nanowire (NW) FETs is carried out, as a function of temperature for the first time. It is shown that at room temperature, NW width decrease improves gate coupling favoring longitudinal band-to-band-tunneling, which increases normalized GIDL current. The increase of GIDL current with fin narrowing becomes more pronounced with temperature reduction. The influence of fin width has been evaluated, showing that GIDL variation with temperature depends on the device geometry.
- Experimental Comparison of Junctionless and Inversion-Mode Nanowire MOSFETs Electrical Properties at High Temperatures(2022-08-22) PRATES, R. R.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.This work aims to present the electrical properties of junctionless and inversion-mode nanowires MOSFETs in the temperature range from 300 K to 580 K. Devices with different fin widths are compared. The comparison is performed using experimental data looking for some of the fundamental electrical parameters of these transistors such as threshold voltage, inverse subthreshold slope, current, and carrier mobility over the temperature.
- Electrical characteristics of n-type vertically stacked nanowires operating up to 600 K(2022-08-05) MARINIELLO, G.; BARRAUD, S.; VINET, M.; CASSE, M.; FAYNOT, O.; CALCADE, J.; Marcelo Antonio Pavanello© 2022 Elsevier LtdThis paper aims at analyzing the electrical characteristics of n-type vertically stacked nanowires with variable fin width, operating in the temperature range of 300–600 K. Basic electrical parameters, such as threshold voltage, subthreshold slope, and carrier mobility are extracted in the linear region, whereas the transconductance, output conductance, and intrinsic voltage gain are extracted in saturation, to access some of device's analog figures of merit. Also, it has been analyzed the DIBL, GIDL, Ion, and Ioff. currents.
- Pragmatic evaluation of fin height and fin width combined variation impact on the performance of junctionless transistors(2022-01-05) RIBEIRO, T. A.; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; Marcelo Antonio PavanelloThis work performs a pragmatic evaluation of the different junctionless devices architectures with channel lengths down to 30 nm on their electrical characteristics. By adopting multiple combinations between the fin height (HFIN) and the fin width (WFIN), chosen from the range of published data in the literature, the devices will operate from double-gate (FinFET like) mode towards to nanowire mode. Additionally, junctionless transistors with and without additional doping at the drain and source extensions were studied. Experimentally calibrated 3D TCAD simulations are used to allow for the study of these several combinations. Results show that for long-channel devices the best performance is obtained for tall and narrow fins, leading to the highest on-to-off current ratio (ION/IOFF) and the smallest values of subthreshold swing and DIBL. On the other hand, for short channel devices, independently of the doping level of the extensions, the best results are found for short HFIN and narrow WFIN, leading to the smaller values of subthreshold swing and DIBL, with a high ION/IOFF ratio. However, the use of doped extensions degrades the overall device performance of short-channel junctionless devices as will be demonstrated.
- Temperature Influence on the Electrical Properties of Vertically Stacked Nanowire MOSFETs(2021-08-27) RODRIGUES, J. C.; MARINELLO, G.; CASSE, M.; BARRAUD, S.; VINET, M.; FAYNOT, O.; Marcelo Antonio PavanelloThis paper aims at analyzing the electrical characteristics of 2-level Stacked Nanowire MOSFETs at low temperatures. Fundamental device parameters such as threshold voltage, subthreshold slope and transconductance are evaluated in the temperature range of 160K to 400K. The influence of fin width variation is also studied. An analytical model of multiple-gate nanowire MOSFETs is employed to explain the experimentally observed data. It is demonstrated that the threshold voltage increases linearly with the temperature reduction. Stacked nanowires with wider fin width presents larger threshold variation with temperature. c2021 IEEE.
- Electrical characterization of stacked SOI nanowires at low temperatures(2022-05-05) RODRIGUES, J. C.; MARINIELLO, G.; CASSE, M.; BARRAUD, S.; VINET, M.; FAYNOT, O.; Marcelo Antonio PavanelloThis work presents the electrical characterization of 2-level vertically stacked nanowire MOSFETs with variable fin widths in the temperature range from 93 K to 400 K. The basic electrical properties, such as threshold voltage, subthreshold slope, and carrier mobility are examined in the linear region with low VDS. In sequence, certain analog figures of merit such as the transconductance, the output conductance, and the voltage gain are assessed in saturation. The threshold voltage variation with temperature is linear and slightly increases for wider devices, which was satisfactorily validated by an analytical model for 3D devices. Additionally, the subthreshold slope remains close to the theoretical limit in the whole range of temperatures. The intrinsic voltage gain is weakly temperature-sensitive in the studied range regardless of the fin width. On the other hand, it increases for narrow devices in all temperatures.
- Evaluation of Analog Characteristics of n-Type Vertically Stacked Nanowires(2020-09-01) MARINELLO, GENARO; BARRAUD, SYLVAIN; VINET, MAUD; FAYNOT, OLIVIER; PAZ, BRUNA CARDOSO; Marcelo Antonio PavanelloThis paper aims at analyzing the analog characteristics of n-type vertically stacked nanowires with 2 channels, varying the fin width and channel length. The basic electrical parameters such as threshold voltage and subthreshold slope are extracted in the linear region, whereas the transconductance, output conductance, and intrinsic voltage gain are extracted in saturation.