Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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35 resultados
Resultados da Pesquisa
- Comparative of analog performance of transcapacitances in asymmetric self-cascode and graded-channel SOI nMOSFETs(2023-01-04) ALVES, C. R.; Michelly De Souza© 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.This work presents a comparative study of the transcapacitances of an asymmetric self-cascode (A-SC) and graded-channel (GC) silicon-on-insulator (SOI) nMOSFETs with different gate lengths. This analysis was done by means of two-dimensional numerical simulations. Simulated results show the influence of others transcapacitances on the gate-to-gate capacitance for the ASC SOI device and the GC SOI device.
- Comparative Analysis of Transcapacitances in Asymmetric Self-Cascode and Graded-Channel SOI nMOSFETs(2022-07-04) ALVES, C. R.; D'OLIVEIRA, L. M.; Michelly De Souza© 2022 IEEE.This work presents a comparative study of the transcapacitances of asymmetric self-cascode (A-SC) and graded-channel (GC) silicon-on-insulator (SOI) nMOSFETs, by means of two-dimensional numerical simulations. Simulated results show that the gate-to-drain capacitance is smaller for the ASC SOI device if compared to the GC SOI device, despite of the applied VDS.
- Analysis of Capacitances in Asymmetric SelfCascode SOI nMOSFETs(2021-08-27) ALVES, C.R.; D' OLIVEIRA, L. M.; Michelly De Souza©2021 IEEE.This work presents a study of the capacitance of asymmetric self-cascode silicon-on-insulator (ASC SOI) MOSFETs with similar gate areas and different gate lengths. Experimental results of total gate capacitance of different ASC are presented and complemented with the results of twodimensional simulations. The transcapacitances are explored through two-dimensional simulations. Results show that different channel lengths of the composite transistors have more influence in the depletion region of the capacitance curves for low VDS. The gate-source and gate-drain capacitances show opposite trends with the change in the lengths of source and drain transistors, despite of the VDS applied.
- Global and/or local strain influence on p- and nMuGFET analog performance(2011-01-05) AGOPIAN, P. G. D.; MARTINO, J. A.; SIMOEN, E.; CLAEYS, C.In this work, the analog performance is evaluated for tri-gate p-and nMuGFETs processed with and without the implementation of different global or local strain engineering techniques. For n-channel devices, the intrinsic voltage gain showed to be worse for strained devices when the fin is narrow. Only for wider fins the voltage gain increases with the strain efficiency due to mobility enhancement. Besides the voltage gain, the transconductance, output conductance and Early Voltage are also evaluated. In spite of the smaller impact of strain engineering, pMuGFETs show better analog behavior for all studied parameters. ©The Electrochemical Society.
- Comparison between SOI nMOSFET's under uniaxial and biaxial mechanical stress in analog applications(2011-09-02) DE SOUZA, M. A. S.; SOUZA, F. N.; Michelly De Souza; Marcelo Antonio PavanelloThis work presents a study comparing the analog performance of uniaxially and biaxially strained planar Silicon-on-Insulator nMOSFETs for a wide range of channel lengths. The study is performed via two-dimensional numerical and process simulation and supported by experimental measurements. The comparison between devices from the same technology with these two strained techniques demonstrated that higher intrinsic voltage gain is obtained for biaxial mechanical stress. However, the transconductance is higher for uniaxial mechanical stress for shorter devices (below 550 nm) leading to larger unity gain frequency. On the other hand, despite both strain techniques degrades the output conductance, this degradation with channel length shortening is less pronounced for devices under biaxial mechanical stress. © The Electrochemical Society.
- Impact of proton irradiation on strained triple gate SOI p- and n-MOSFETs(2011-09-23) AGOPIAN, P. G. D.; MARTINO, J. A.; KOBAYASHI, D.; SIMOEN, E.; CLAEYS, C.In this work the proton irradiation influence on basic and analog parameters of triple-gate SOI MOSFETs is investigated. The studied devices are strained and unstrained p- and nMuGFETs. The type of stress considered in each case, was the stress that results in a better performance of p- (CESL) and n-devices (sSOI+CESL). Although the results showed the worse behavior for post-irradiated nMOS transistors, a higher immunity to the back interface influence was obtained for post-irradiated pMOS devices and consequently a better analog performance was observed. The unit gain frequency improved for p and nMOS post-irradiated devices. © 2011 IEEE.
- Asymmetric self-cascode configuration to improve the analog performance of SOI nMOS transistors(2011-10-11) Michelly De Souza; FLANDRE, D.; Marcelo Antonio PavanelloIn this work an asymmetric self-cascode (SC) structure implemented in a 150nm technology have been studied as a function of the threshold voltage and length of both transistors in the structure, aiming to improve the analog characteristics of FD SOI transistors. Experimal results indicate that this structure provided improvement in comparison to single and symmetric (SC) transistors, and that it depends on the saturation voltage of both transistors. The effect of threshold voltage and length variation of both transistors have been analyzed through 2D numerical simulations. The obtained results showed that the analog characteristics of the A-SC is improved both by reducing V T,2 and increasing L 1 and/or L 2, although there would be a maximum M 2 length in which no significant g D reduction is observed. By properly choosing these parameters, a g D reduction of more than one order of magnitude can be achieved. The A-SC has shown to provide an intrinsic voltage gain improvement of more than 20dB in comparison to single devices with similar effective channel length. © 2011 IEEE.
- Uniaxial stress efficiency for different fin dimensions of triple-gate SOI nMOSFETs(2011-10-06) BÜHLER, Rudolf Theoderich; AGOPIAN, P. G. D.; Renato Giacomini; SIMOEN, E.; CLAEYS, C.; MARTINO, J. A.The stress profiles extracted showed that the variation in the silicon fin dimensions influence the stress levels and distributions along the silicon fin. From the analog performance view, these variations in the stress have influence on some electric parameters. The reduction of the total fin length showed no significant change in the parameters, although a reduction in the stress level was noticed, leading to the conclusion that the shift in the stress level is too small to cause a pronounced impact on the parameters. On the other hand, the reduction of the silicon fin height showed more interesting results. Despite that the standard device with smaller fin height presented a lower intrinsic voltage gain performance when compared to the reference device, when implementing strain it supersedes the reference device and presented an enhancement in the intrinsic voltage gain over the standard one up to 8 %, larger than the 5.1 % obtained for the reference device. © 2011 IEEE.
- Application of junctionless nanowire transistor in the self-cascode configuration to improve the analog performance(2012-09-02) Rodrido Doria; TREVISOLI, R. D.; Michelly De Souza; Marcelo Antonio PavanelloThe self-cascode (SC) configuration consists in a series association of two transistors with tied gates usually applied to improve the analog performance of MOS devices. This paper compares the analog parameters of single Junctionless transistors with the ones presented by self-cascode associations composed by two Junctionless devices with identical or different fin widths (symmetric and asymmetric, respectively). The transconductance to the drain current ratio, the Early voltage (VEA) and the intrinsic voltage gain (AV) have been evaluated for both single devices and SC structures. It has been shown that the SC configurations, specially the asymmetric ones, present a strong reduction of the drain conductance (gD) with respect to single devices, resulting in an increase of VEA and AV, which can be higher than 30 dB depending on the bias conditions. © The Electrochemical Society.
- Influence of 60-MeV proton-irradiation on standard and strained n-and p-Channel MuGFETs(2012-01-05) AGOPIAN, P. G. D.; MARTINO, J. A.; KOBAYASHI, D.; SIMOEN. E.; CLAEYS. C.In this work the proton irradiation influence on Multiple Gate MOSFETs (MuGFETs) performance is investigated. This analysis was performed through basic and analog parameters considering four different splits (unstrained, uniaxial, biaxial, uniaxial+biaxial). Although the influence of radiation is more pronounced for p-channel devices, in pMuGFETs devices, the radiation promotes a higher immunity to the back interface conduction resulting in the analog performance improvement. On the other hand, the proton irradiation results in a degradation of the post-irradiated n-channel transistors behavior. The unit gain frequency showed to be strongly dependent on stress efficiency and the radiation results in an increase of the unit gain frequency for splits with high stress effectiveness for both cases p-and nMuGFETs. © 2012 IEEE.