Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
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16 resultados
Resultados da Pesquisa
- Analysis of the Gate-Induced Drain Leakage of SOI Nanowire and Nanosheet MOS Transistors at High Temperatures(2022-07-04) Michelly De Souza; CERDEIRA, A.; ESTRADA, M.; BARRAUD, S.; CASSE, M.; VINET, M.; FAYNOT, O.; Marcelo Antonio Pavanello© 2022 IEEE.This work presents a comparison between the Gate-Induced Drain Leakage (GIDL) current of the nanowire (tri-gate MOSFET with narrow fin width) and nanosheet (tri-gate MOSFET with wide fin width) SOI MOSFETs at high temperatures, in the range between 300 K and 580 K. The study is conducted using experimental data, corroborated with 3D TCAD simulations. It is demonstrated that the GIDL current normalized by the total fin width is larger in nanosheet MOSFET than for the nanowire at high temperatures. Additionally, the nanosheet device presents a larger variation of the normalized GIDL current with the temperature than the nanowire one.
- Channel length influence on the analog characteristics of asymmetric self-cascode association of SOI transistors(2013-09-06) DE SOUZA, M.; FLANDRE. D.; Marcelo Antonio PavanelloThis paper presents an experimental analysis of channel length influence on the analog characteristics of asymmetric self-cascode association of SOI transistors. It is shown that the increase of the drain current and transconductance is more pronounced with the reduction of the length of the transistor close to the source (L1), and, differently from the symmetric self-cascode, suffers little influence of the length close to the drain (L2). On the contrary, the output conductance of symmetric and asymmetric threshold voltage structures is benefited by the increase of L 2 and L1, although the asymmetric structure may offer a reduction of up to one order of magnitude in comparison to the symmetric one. It results in larger intrinsic voltage drain for asymmetric devices. This increase has shown to reach more than 20 dB for similar dimensions, or allow for dimension reduction without intrinsic gain degradation. © 2013 IEEE.
- Analysis of matching in graded-channel SOI MOSFETs(2007-09-06) Michelly De Souza; FLANDRE, D.; Marcelo Antonio PavanelloThis paper presents an analysis of mismatch in Graded-Channel (GC) SOI MOSFETs. Experimental results show that GC devices present poorer threshold voltage and drain current matching in comparison to conventional SOI counterpart. The analytical model for the drain current of GC devices is used to investigate the reasons for this matching worsening. Two-dimensional numerical simulations are used to predict the matching behavior both in linear and saturation regions. © The Electrochemical Society.
- Impact of graded-channel SOI MOSFET application on the performance of Cascode and Wilson current mirrors(2007-09-06) FLANDRE, D.; Marcelo Antonio PavanelloThis work shows the impact of the use of graded-channel SOI MOSFETs (GC) in Wilson and Cascode current mirrors. The study was made through bi-dimensional simulations and experimental measurements, focusing on the mirroring precision, the output swing voltage (VOS) and output resistance of each architecture comparing with the conventional SOI devices. It was observed that the devices of graded-channel (GC) presented some improvement in the mirroring precision and a significant increase in the output resistance and output swing in all the architectures studied if compared to standard fully depleted SOI MOSEET. the setting time of GC current mirrors has been Also studied and has demonstrated improvements in relation to conventional SOI devices. © The Electrochemical Society.
- Temperature influences on FinFETs with undoped body(2007-05-11) Marcelo Antonio Pavanello; MARTINO J. A.; SIMOEN, E.; ROOYACKERS, R.; COLLAERT, N.; CLAEYS, C.This work presents a study, based on DC measurements, of the temperature influence on the performance of nMOS triple-gate FinFETs with high-κdielectrics, TiN gate material and an undoped body. FinFETs show smaller threshold voltage variations with temperature than planar fully-depleted SOI MOSFETs. The subthreshold slope reduced with the temperature and approached the ideal value at lower temperatures In the temperature range under study the mobility increases linearly as the temperature is reduced and the dominating mobility degradation factor is phonon scattering. The DIBL has been evaluated and no temperature dependence has been found. Finally, the series resistance has been also extracted and demonstrates a reduction as the temperature is reduced due to the mobility improvement. © The Electrochemical Society.
- Analysis of the low-frequency noise in graded-channel and standard SOI nMOSFET(2010-01-05) DA SILVA, E. L. R.; MIGUEZ, M.; Michelly De Souza; ARNAUD, A.; Marcelo Antonio PavanelloIn this paper a comparison between the low-frequency noise in graded-channel SOI nMOSFETs (GC SOI MOSFET) and standard fully depleted (FD) SOI nMOSFETs will be presented. The evolution of noise with bias and frequency, mainly in the GC SOI MOSFETs, will be demonstrated. Numerical bidimensional simulations are used to reproduce the same tendencies observed experimentally in order to allow for a physical insight on the noise in GC SOI transistors. ©The Electrochemical Society.
- An analytical model for the non-linearity of triple gate SOI MOSFETs(2011-01-05) Rodrigo Doria; MARTINO, J. A.; SIMOEN, E.; CLAEYS, C.; Marcelo Antonio PavanelloThis work proposes a physically-based analytical model for the non-linearity of Triple-Gate MOSFETs. The model describes the second order harmonic distortion (HD2), usually the major non-linearity source, as a function of the device dimensions, the series resistance, the low field mobility and the mobility degradation factor (θ). The model was applied to transistors of different channel lengths and fin widths and allowed to conclude that θ is the parameter which most contributes for the increase of HD2. The model was validated for both unstrained and strained FinFETs. ©The Electrochemical Society.
- Analog performance of submicron GC SOI MOSFETs(2012-03-17) NEMER J. P.; Michelly De Souza; Marcelo Antonio Pavanello; FLANDRE, D.This paper aims to demonstrate the performance of GC SOI MOSFET devices in comparison to standard SOI MOS transistors, comparing the improvements achieved by the adoption of the GC architecture in a submicron fully depleted SOI technology varying the channel length. The results obtained by two-dimensional numerical simulations show that the best improvement is obtained when the length of lightly doped region length is approximately 100 nm, independently of the total channel length. © 2012 IEEE.
- Liquid helium temperature analog operation of asymmetric self-cascode FD SOI MOSFETs(2012-10-04) Michelly De Souza; KILCHTYSKA, V.; FLANDRE, D.; Marcelo Antonio PavanelloFully Depleted (FD) SOI technology is well known to provide improved analog performance of CMOS transistors [1, 2]. However, FD SOI transistors may suffer from parasitic bipolar effects (PBE) that cause the degradation of the output conductance [3]. The use of cascode transistors with common gate (making a self-cascode-SC topology) has been shown to reduce the output conductance of MOSFETs, while keeping some advantages of long-channel transistors [4]. Fig. 1 represents the self-cascode transistor, composed by transistors MS and MD, with channel lengths LS and LD, and threshold voltages VT, S and VT, D, respectively (with VT, S = VT, D in the symmetric SC-S-SC). Recent works [5, 6] showed that the use of different threshold voltages (VT) for MS and MD (so-called asymmetric self-cascode-A-SC) is able to further enhance the analog properties of SC n-and pMOS transistors, in comparison to the S-SC, at room temperature (RT). In this paper the enhanced analog performance of asymmetric SC structure is experimentally demonstrated at deep cryogenic environments emphasizing its capability to minimize (or even suppress) PBE in FD SOI n-and p-type MOSFETs at liquid helium temperature (LHT), where this effect is more pronounced [7]. © 2012 IEEE.
- Low frequency noise in submicron Graded-Channel SOI MOSFETs(2013-09-06) NEMER, J. P.; Michelly De Souza; FLANDRE, D.; Marcelo Antonio PavanelloThe origin of the low-frequency noise in submicron fully depleted Graded-Channel (GC) SOI MOSFET is investigated in terms of the channel length comparing two different technologies, OKI semiconductors and UCL. © 2013 IEEE.