Engenharia Elétrica
URI permanente desta comunidadehttps://repositorio.fei.edu.br/handle/FEI/21
Navegar
10 resultados
Resultados da Pesquisa
- Ultra-Low-Power Diodes Composed by SOI UTBB Transistors(2022-07-04) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to present an analysis of the performance of Ultra-Thin-Body and Buried Oxide transistors working as Ultra-Low-Power diodes. The implementation of different ground planes and substrate biases are analyzed. It is shown a reduced leakage current and increased ratio between the on and off-state currents for the Ultra-Low-Power diode with the N-substrate biased at -2V. However, this condition results in increased threshold voltage. The ground planes do not provoke a significant change in the leakage current, but a noticeable variation can be observed in the ratio between the on and off-state currents due to the higher threshold voltage in relation to the system without ground plane.
- Standard MOS Diodes Composed by SOI UTBB Transistors(2022-08-05) COSTA, F. J.; TREVISOLI, R.; CAPOVILLA, C. E.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to present an analysis of the performance of UTBB SOI transistors working as standard diodes, where the implementation of ground planes and substrate bias are analyzed. It is shown a reduced leakage current and increased ratio between the on and off-state currents with the substrate bias at -2 V and with a P-type GP implemented. However, both conditions result in increased threshold voltage.
- SOI UTBB Capacitive Cross-Coupling Effects in Ultimate Technological Nodes(2022-03-01) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2022 IEEE.The main objective of this work is to carry out an analysis of the effects of cross-coupling in a system composed of SOI UTBB MOSFETs in ultimate integration nodes through numerical simulations, validated with experimental data from literature. In this analysis, it could be observed that two devices located on the channel length direction provoke a reduced cross-coupling on each other. For devices located at distances below 50 nm, a capacitive parasitic coupling between the devices can be observed along with the thermal coupling effect.
- Cross-coupling effects in common-source current mirrors composed by UTBB transistors(2022) JOSÉ DA COSTA, F.; TREVISOLI, R.; Rodrigo Doria© 2022 Elsevier LtdThis work performs an analysis of the cross-coupling effects influence on the performance of current mirrors composed by advanced UTBB SOI MOSFETs through 3D numerical simulations validated to experimental data of single devices. It is shown the presence of a capacitive coupling acting in the system, which can be demonstrated through the threshold voltage reduction at small distances between devices. Additionally, the temperature rise in the system due to the thermal coupling provokes a decrease in the input current as the devices become closer to each other. This is responsible for an increase of 3 % on ID2/ID1 ratio when the devices are biased at the same time and when the distance between them is lowered to 100 nm.
- Analysis of the substrate bias effect on the thermal properties of SOI UTBB transistors(2017-08-28) COSTA, F. J.; Marcelo Antonio Pavanello; TREVISOLI, R.; Rodrigo DoriaThis work presents an analysis of the thermal resistance of Ultra-Thin Body and Buried Oxide (UTBB) SOI (Silicon-on-Insulator) MOSFETs (Metal Oxide Semiconductor Field Effect Transistor) under a selected set of back gate biases (Vsub), with and without considering the effect of the ground plane. It has been shown that the thermal resistance increases as the substrate bias is reduced. For negative Vsub, a thicker depletion depth is induced by the back gate, confining the overall current closer to the front gate and increasing its density. A thermal resistance reduction of about 8-9% can be obtained by simply increasing the back bias from -2V up to 2 V.
- Analysis of the output conductance degradation with the substrate bias in SOI UTB and UTBB transistors(2018-08-31) FERNO COSTA, J.; TREVISOLI, R.; Rodrigo Doria© 2018 IEEE.The goal of this work is to present the behavior of the output conductance in Ultra-Thin Body (UTB) and Ultra-Thin Body and Buried Oxide (UTBB) SOI {MOSFETs with the application of a selected set of back gate biases (VSUB) through AC simulations, in devices with and without considering the effect of the ground plane. It has been shown that the output conductance degradation due to self-heating and substrate effects increases as the substrate bias is reduced. The output conductance degradation by self-heating presents a reduction of about 52% and by substrate effects of 57% by simply increasing the back bias from-2V up to 2 V.
- Analysis of the substrate effect by the capacitive coupling in SOI UTBB Transistors(2019-08-30) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2019 IEEE.The goal of this work is to present the behavior of the substrate effect in Ultra-Thin Body and Buried Oxide (UTBB) SOI MOSFETs with the application of a selected set of back gate biases (VSUB) through DC and AC simulations. A set of different ground planes (GP) arrangements has been considered. It has been shown that the degradation due to the substrate effects increases as the substrate bias is reduced. According to the analysis, it could be observed the GP type influences the capacitive coupling of the structure as the back gate bias is varied. Additionally, it has been shown that the presence of the GP below the source and drain regions contributes significantly to the overall capacitive coupling of the device.
- Analysis of the Thermal Properties of Self-Cascode Structures Composed by UTBB Transistors(2020) COSTA, F. J.; TREVISOLI, R.; Michelly De Souza; Rodrigo Doria© 2020 IEEE.The focus of this work is to perform an analysis of the thermal properties of the Self-Cascode (SC) structure composed by advanced UTBB SOI MOSFETs under a selected set of back gate biases, through 2D numerical simulations. In this work, it could be observed that the SC structure presents a 50 % lower thermal resistance in comparison with a single device with similar channel length. The application of a back gate bias of 2 V to the drain-sided device or -2 V to the source-sided devices of the SC has shown a decrease of 10-16 % in the thermal resistance.
- Effect of substrate bias and temperature variation in the capacitive coupling of soi utbb mosfets(2021-08-23) DA SILVA, E. M.; TREVISOLI, R.; Rodrido Doria© 2021, Brazilian Microelectronics Society. All rights reserved.In this work, the electrical features related to the capacitive coupling and temperature influence of the Ultra-Thin Body and Buried Oxide SOI MOSFET (UTBB) transistors are explored through numerical simulations calibrated to experimental data. The impact of the substrate bias is observed for a set of values ranging from-3 V to 2 V for a temperature range between 100 K and 400 K. Also, structures with n-and ptype ground planes (GP-P and GP-N) and without GP have been evaluated. This approach analyzes the capacitive coupling through the body factor and shows that the negative biasing for all GP types significantly improves the structure coupling and that the device with P-type ground plane has the lowest value of body factor for all the evaluated conditions. The dependence of the body factor on the temperature has shown to be negligible for longer devices. However, for devices shorter than 50 nm, the position of the maximum electrons concentration inside the silicon layer may affect the capacitive coupling.
- Thermal cross-coupling effects in side-by-side UTBB-FDSOI transistors(2021-11-05) COSTA, F. J.; TREVISOLI, R.; Rodrigo Doria© 2021 Elsevier LtdThe focus of this work is to perform a first-time analysis of the thermal cross-coupling of a device on a neighbor one in advanced UTBB transistors through 3D numerical simulations, validated with experimental data from the literature. In this work, it could be observed that the temperature rise due to a self-heated device can affect the performance of a neighbor one according to the distance between them and to the bias conditions. By varying the distance of the devices from 1 µm to 50 nm, it is shown an influence of the temperature rise due to a self-heated device in threshold voltage, subthreshold swing and in the maximum transconductance as well an increase in the thermal resistance of a neighbor device.